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IPC Introduces First Standard for In-Mold Electronics

11/18/2024 | IPC
IPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.

Despite Regional 200x Funding Differences, Post-Quantum Readiness Won’t Hinder eIDAS Unity

11/05/2024 | ABI Research
Post-Quantum Cryptography (PQC) inevitably has an outsized impact on a technology remit covering many trust service use cases, with cryptographically robust signing acting as the market's core. Without this, there is no trust and, therefore, no Electronic Identification and Trust Services (eIDAS).

The ICAPE Group Announces the Launch of Its E-Shop at Electronica

10/31/2024 | BUSINESS WIRE
The ICAPE Group, a global technology distributor of printed circuit boards (PCB) and custom-made electromechanical parts, today announced its participation at the 2024 edition of Electronica, where it will present the ICAPE Shop, its new online purchasing platform.

2024 IPC CEMAC China Electronics Manufacturing Annual Conference Focuses on the Electronics Industry’s Future

10/24/2024 | IPC
The 2024 IPC CEMAC China Electronics Manufacturing Annual Conference, co-organized by IPC and the Shanghai Pudong New Area Quality Technology Association, kicked off with a grand opening ceremony in Shanghai. Themed "Making Your Imagination Reality," the event has brought together leaders, technical experts, and corporate representatives from the global electronics manufacturing industry to explore future trends and opportunities.

Counterfeit Concerns: Navigating the Risks

10/23/2024 | Nolan Johnson, SMT007 Magazine
Nolan Johnson meets with Diganta Das, PhD, and Michael Azarian, PhD, research scientists at the CALCE Electronic Products and Systems Center at the University of Maryland, to discuss the increasing issue of counterfeiting in the electronics and assembly industry. Diganta and Michael highlight the need for robust detection methods and standards to mitigate risks, specifically referencing SAE AS6171 for inspection and AS5553 for counterfeit mitigation. They cover real-world cases, like counterfeit network equipment scandals to relatively simple issues of consumer electronics accessories to illustrate the complexity of the issue and debate the philosophical implications of labeling products that contain a few minor counterfeit components as “counterfeit.”
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