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The electronics industry supply chain is moving very quickly with the explosion of AI servers, high-performance computing, ADAS, quantum computing, and 5G/6G. Signal integrity is under scrutiny in an entirely new role. With many factors influencing signal integrity, one area that contributes to signal distortion at high frequencies is the PCB’s final finish layer deposits. Frequencies above 40 GHz are susceptible to such distortions, and data transfer rates of 224 GB/s are driving changes in PCBs and IC substrates.

Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish

05/07/2026 | Matt Stevenson -- Column: Connect the Dots
When designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.

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Indium to Showcase Innovative Materials Powering AI Technology at Productronica China

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