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Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish

05/07/2026 | Matt Stevenson -- Column: Connect the Dots
When designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.

Uyemura Opens Dedicated UBM and Prototype Plating Line at Southington Tech Center

11/25/2025 | Uyemura
Uyemura has commissioned a dedicated plating tool at its Southington, CT Tech Center that addresses 3 urgent needs.

DuPont/Qnity Innovators in Semiconductor Materials Named 2025 Heroes of Chemistry

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DuPont today announced that 13 of its current and former scientists and engineers have been named 2025 Heroes of Chemistry by the American Chemical Society (ACS) for an innovative program that progressed semiconductor lithography.

Indium to Showcase Innovative Materials Powering AI Technology at Productronica China

03/25/2025 | Indium Corporation
As a proven leader in Metal-Based Thermal Interface materials solutions for future-forward technologies, Indium Corporation will proudly showcase its portfolio of thermal interface materials (TIMs) that enabling AI advancements at Productronica China, March 26-28, in Shanghai, China.

Connect the Dots: Designing for Reality—Surface Finish

01/29/2025 | Matt Stevenson -- Column: Connect the Dots
In the previous episode of I-Connect007’s On the Line with… podcast, we discussed the solder mask and legend process, one of the final steps in the PCB manufacturing process. The board is nearly complete. We just need to wrap up production by applying a surface finish to protect the copper from oxidation and facilitate soldering components onto the board.
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