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Exploring Advanced PCB Final Finishing: DIG, RAIG Technologies

10/24/2024 |  Rich DePoto, Uyemura
In this interview, Rich DePoto of Uyemura provides a deep overview and explanation of Reduction-assisted Immersion Gold (RAIG) and direct immersion gold (DIG) technology, and their applications and benefits when compared to traditional final finishes. He delves into the intricacies of electroless nickel corrosion and “black pad,” exploring its causes, consequences, and the measures that can be taken to mitigate this problem. This comprehensive overview will provide insight toward sound decision-making for those operating in environments where perfect process control is a challenge.

FIT Hon Teng Showcases AI Data Center Connectivity and Immersion-Cooled Signal Integrity Solutions at OCP Global Summit 2024

10/21/2024 | Foxconn
FIT Hon Teng, a subsidiary of Hon Hai Precision Industry, will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit.

Indium Experts to Present Advanced Research at International Symposium on Microelectronics

09/20/2024 | Indium
Indium Corporation experts will lead three presentations and a poster presentation at the 57th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), from October 1-3, in Boston, Massachusetts.

Real Time with… IPC APEX EXPO 2024: Exploring the Future of Surface Finishes

04/25/2024 | Real Time with...IPC APEX EXPO
Joe McGurran, product marketing director for MKS Atotech, looks into the future of surface finishes, discussing less nickel, reduced thickness, technologies influencing HDI and UHDI, and the benefits of nickel-free surface finishes. He also touches on popular finishes like ENIG and palladium immersion gold and discusses the value proposition of making a change.

Reassessing Surface Finish Performance for Next-gen Technology, Part 2

03/04/2024 | Frank Xu, PhD and Martin Bunce of MacDermid Alpha, and John Coonrod of Rogers Corp.
The introduction of 5G/6G has created a growing demand for faster rates of data transfer and operation at higher frequencies, pushing signals to travel toward the outer edges of conductors. As a result, the surface finish applied over the copper circuitry is now gaining more attention.
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