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In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Surface Finish: Tune in to the Latest Podcast Episode of On the Line with… ASC Sunstone
September 4, 2024 | I-Connect007Estimated reading time: Less than a minute
Don't miss episode 11 of "On the Line with… ASC Sunstone: Designing for Reality," in which ASC Sunstone’s General Manager, Matt Stevenson, discusses the critical topic of surface finishes in PCB manufacturing.
Continuing our deep dive into the PCB manufacturing process, Matt discusses the various types of surface finishes, including Hot Air Solder Leveling (HASL), Immersion Silver, ENIG (Electroless Nickel Immersion Gold), ENIPIG (Electroless Nickel Immersion Palladium Immersion Gold), and Immersion Tin. Each finish is broken down in terms of its benefits, drawbacks, and ideal applications, offering listeners valuable insights into choosing the right finish for their specific needs.
I-Connect007 is dedicated to delivering high-quality digital content specifically designed for the electronics industry. With a portfolio that includes magazines, books, newsletters, market reports, podcasts, and event coverage, the company consistently provides the insights and information professionals need. As the industry's longest-running digital media company, I-Connect007 continues to set the standard as a leading publisher of original content for the global electronics community.
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Suggested Items
Exploring Advanced PCB Final Finishing: DIG, RAIG Technologies
10/24/2024 | Rich DePoto, UyemuraIn this interview, Rich DePoto of Uyemura provides a deep overview and explanation of Reduction-assisted Immersion Gold (RAIG) and direct immersion gold (DIG) technology, and their applications and benefits when compared to traditional final finishes. He delves into the intricacies of electroless nickel corrosion and “black pad,” exploring its causes, consequences, and the measures that can be taken to mitigate this problem. This comprehensive overview will provide insight toward sound decision-making for those operating in environments where perfect process control is a challenge.
FIT Hon Teng Showcases AI Data Center Connectivity and Immersion-Cooled Signal Integrity Solutions at OCP Global Summit 2024
10/21/2024 | FoxconnFIT Hon Teng, a subsidiary of Hon Hai Precision Industry, will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit.
Indium Experts to Present Advanced Research at International Symposium on Microelectronics
09/20/2024 | IndiumIndium Corporation experts will lead three presentations and a poster presentation at the 57th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), from October 1-3, in Boston, Massachusetts.
Real Time with… IPC APEX EXPO 2024: Exploring the Future of Surface Finishes
04/25/2024 | Real Time with...IPC APEX EXPOJoe McGurran, product marketing director for MKS Atotech, looks into the future of surface finishes, discussing less nickel, reduced thickness, technologies influencing HDI and UHDI, and the benefits of nickel-free surface finishes. He also touches on popular finishes like ENIG and palladium immersion gold and discusses the value proposition of making a change.
Reassessing Surface Finish Performance for Next-gen Technology, Part 2
03/04/2024 | Frank Xu, PhD and Martin Bunce of MacDermid Alpha, and John Coonrod of Rogers Corp.The introduction of 5G/6G has created a growing demand for faster rates of data transfer and operation at higher frequencies, pushing signals to travel toward the outer edges of conductors. As a result, the surface finish applied over the copper circuitry is now gaining more attention.