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In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
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Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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IBIDEN Announces Issuance of JPY 15 Billion Unsecured Bonds
August 30, 2024 | IBIDENEstimated reading time: Less than a minute
IBIDEN Co., Ltd., a leading manufacturer of advanced electronic materials, announced the issuance of JPY 15 billion (approximately USD 110 million*) in unsecured bonds.
Details of the Bond Issuance:
- Issuance Amount: JPY 15 billion
- Maturity: Five years
- Interest Rate: To be determined by market conditions
- Use of Proceeds: The proceeds from the issuance will be used for general corporate purposes, including investments in capital expenditures and research and development.
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KATEK Carries Out Successful Capital Increase, Wins a Number of New Investors
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