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September Design007 Magazine: Silicon to Systems
September 9, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

Silicon to Systems: From Soup to Nuts
Traditionally, most designers of PCBs and ICs have operated in separate silos, unaware of much of what is happening just upstream or downstream. IC designers did their thing and PCB designers did theirs, and everything worked—until recently, that is.
Now, the increase in complexity in electronics is driving technologists throughout the electronics supply chain to adopt a “silicon to systems” outlook. Advanced packaging systems are causing PCB designers problems with signal integrity, power delivery requirements, and thermal issues.
This month, in the September 2024 issue of Design007 Magazine, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain—from soup to nuts.
Suggested Items
Material Selection and RF Design
04/21/2025 | Andy Shaughnessy, Design007 MagazineInnovation rarely sleeps in this industry, and the RF laminate segment offers a perfect example. RF materials have continued to evolve, providing PCB designers much more than an either/or choice. I asked materials expert Alun Morgan, technology ambassador for the Ventec International Group, to walk us through the available RF material sets and how smart material selection can ease the burden on RF designers and design engineers.
EDA Tools and RF Design Techniques
04/14/2025 | Andy Shaughnessy, Design007 MagazineHigh-speed PCB design is complex enough, but RF design can be a whole new ball game. RF designers have to contend with tuning and other ideas that traditional PCB designers don’t have to worry about, as well as crosstalk, parasitic capacitance, and material limitations. Most PCB design tool companies now offer RF design options, so designers no longer have to use pureplay RF design tools for anything but the most cutting-edge designs. Cadence Design Systems expanded its RF EDA offerings by acquiring the RF software company AWR a few years ago. We asked David Vye, product management director at Cadence, to share his thoughts on EDA software, RF design, and what new RF designers and engineers need to understand.
The Key to First-pass Success in PCB Design
04/10/2025 | Gerry Partida, Summit InterconnectIn the dynamic world of PCB manufacturing, achieving first-pass success hinges on more than just cutting-edge equipment and skilled teams. At Summit Interconnect, we have seen countless successful launches of advanced HDI designs that can be traced directly to engagement between designers and fabricators early in the design phase. Unfortunately, collaboration in the PCB industry often begins only after problems arise—such as field failures, assembly fallout, or low fabrication yields. This reactive approach is the wrong starting point for collaboration.
Real Time with... IPC APEX EXPO 2025: Insights into PCB Design and Manufacturing with Polar Instruments
04/03/2025 | Real Time with...IPC APEX EXPOErik Bateham discusses Polar's latest book, which enhances insights for PCB designers and manufacturers. The book, "The Designer's Guide to... More Secrets of High-Speed PCBs," features a guest chapter on 2D via design modeling. Erik highlights the industry's shift towards UHDI and the challenges in measuring at micron levels.
Target Condition: Designing vs. Inventing
03/27/2025 | Kelly Dack -- Column: Target ConditionAfter hearing me rave about IPC APEX EXPO for years, my boss, Chad Orebaugh, joined me at the show for the first time last year. We met at the registration counter, got our badges, and he said, “Okay, Kelly, impress me.”