Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Connect the Dots: How to Avoid Five Common Causes of Board Failure
September Design007 Magazine: Silicon to Systems
September 9, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Silicon to Systems: From Soup to Nuts
Traditionally, most designers of PCBs and ICs have operated in separate silos, unaware of much of what is happening just upstream or downstream. IC designers did their thing and PCB designers did theirs, and everything worked—until recently, that is.
Now, the increase in complexity in electronics is driving technologists throughout the electronics supply chain to adopt a “silicon to systems” outlook. Advanced packaging systems are causing PCB designers problems with signal integrity, power delivery requirements, and thermal issues.
This month, in the September 2024 issue of Design007 Magazine, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain—from soup to nuts.
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