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iNEMI Presents Packaging Interconnect Material Technology Series with Dr. Kazuhiro Nogita
September 9, 2024 | iNEMIEstimated reading time: Less than a minute
iNEMI, a leading electronics manufacturing industry association, is pleased to announce a two-part webinar series focusing on packaging interconnect material technology. Dr. Kazuhiro Nogita, a leading expert in the field, will present on September 17-24, 2024.
Webinar Series Details:
The webinars will provide valuable insights into:
- Properties of SnBi Low-Temperature Solders (September 17): This session will delve into the fundamental properties of tin-bismuth (SnBi) solder alloys, exploring their unique characteristics and challenges in high-strain rate deformation and thermal cycling.
- Transient Liquid Phase Bonding for High-Temperature Soldering Processes (September 24): This webinar will explore the use of transient liquid phase (TLP) bonding for reliable high-temperature interconnections with SnCu solders.
About the Speaker:
Dr. Kazuhiro Nogita is a highly regarded researcher with extensive experience in lead-free solders, interconnect materials, and more. He holds key positions at the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM) and the University of Queensland.
Registration:
Both webinars are open to industry professionals. Advance registration is required. Please visit the iNEMI site to register:
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Book Excerpt: The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2, Chapter 4
09/25/2024 | I-Connect007 Editorial TeamDirect-bonded copper (DBC) with a ceramic base is a commonly used assembly technology. While advantages include excellent solder crack compensation due to similar CTE values between component and substrate, the construction is fragile and therefore places limits on size and exposure to vibration. Small assemblies in basic shapes such as a rectangle can be done, although larger, more complex shapes become difficult.
Some Fundamentals of Tin-Bismuth Metallurgy and Electromigration
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iNEMI Packaging Tech Topic Webinar: Packaging Interconnect Material Technology Series
09/19/2024 | iNEMIThe International Electronics Manufacturing Initiative (iNEMI) continues its Packaging Interconnect Material Technology Series with a webinar on Transient Liquid Phase (TLP) Bonding for High-Temperature Soldering Processes.