Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week 

09/13/2024 | Marcy LaRont, PCB007 Magazine
At the top of my list is “Silicon to Systems,” an interview with technology experts from IPC: Matt Kelly, Devan Iyer, and Kris Moyer. Also, this week, we hear from I-Connect007 Managing Editor Nolan Johnson, who’s been in Mexico for SMTA Guadalajara. Speaking of Mexico, I want to highlight an interview that appeared in IPC Community between Lorena Villanueva and Barjouth Aguilar of Flex, who talk about the importance of sustainability. I wrap up my recommendations with articles about solder printing and wet process control.

Flex Releases its 2024 Sustainability Report

09/13/2024 | Flex
Flex published its 2024 sustainability report, highlighting the company's global sustainability performance and progress from calendar year 2023.

Registration Open for the 2025 WHMA Annual Global Leadership Summit

08/30/2024 | IPC
Registration is now open for the 2025 WHMA Annual Global Leadership Summit, the industry’s only annual executive networking event for the cable and wire harness manufacturing industry including manufacturers, their suppliers, and customers.

Real Time with… THECA 2024: Innovation and Economy in Factory Design Is Just Smart

08/14/2024 | Real Time with... THECA
Smart Factory Design's CEO, Alex Stepinski, provides an update on his work with zero liquid discharge solutions and lower-investment PCB fabrication setups. Both of these solutions, Stepinski argues, now cost less to operate than traditional methods, while providing more capability and sustainability.

DuPont Recognized with Two Sustainability Awards from Business Intelligence Group

08/08/2024 | DuPont
DuPont has been recognized with two 2024 Sustainability Awards from the Business Intelligence Group —Sustainability Product of the Year for the first ion exchange resin supporting the production of green hydrogen from water and Sustainability Initiative of the Year for a novel formulation supporting post-etch cleans in semiconductor production.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in