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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/10/2025 | Nolan Johnson, I-Connect007
I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.

Mercedes-Benz Shapes Future of Autonomous Computing as Co-Creator of Next-Generation Chip Standards with Athos Silicon

10/09/2025 | Mercedes-Benz
Mercedes-Benz announced a reference design collaboration with Athos Silicon, a specialized semiconductor company established by former engineers at Mercedes-Benz Research & Development North America, Inc. (MBRDNA).

Taiwan Rejects U.S. Proposal for 50-50 Semiconductor Production Split

10/03/2025 | I-Connect007 Editorial Team
Taiwan stated on October 1 that it will not agree to a U.S. proposal to shift half of its semiconductor production to the United States, despite mounting pressure from Washington over tariffs and chip supply security, according to Reuters.

Intel Shares Surge Following Report of Early Talks to Make Chips for Rival AMD

10/03/2025 | I-Connect007 Editorial Team
Intel shares jumped on October 1, following reports that the company is in early talks to manufacture chips for rival AMD through its foundry business, according to CNBC.

Technica Hosts In-House Visit from PCBAA

10/01/2025 | Technica USA
David Schild, Executive Director of PCBAA (Printed Circuit Board Association of America) visited Technica USA to discuss the activity in the market and the advocacy of the PCBAA. The organization was formed to work on Capitol Hill, educating, advocating and getting congressional support to legislate on behalf of building a stronger PCB and substrate manufacturing base in the U.S.A. 
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