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Pioneering the Future of Substrate Manufacturing for North America

04/07/2025 | Marcy LaRont, I-Connect007
In a rapidly evolving manufacturing landscape, the shift toward substrate technology has become a focal point for some companies in the PCB industry. Ralph Jacobo, technical sales and application engineer at all4-PCB, says all4-PCB has its roots in via-filling technology, has successfully navigated various market changes, and is now keenly focused on the demands of substrate manufacturing in North America. Ralph shares insights into the company's historical journey, current initiatives, and the innovative steps being taken to address the complexities of modern substrate processes.

Real Time with... IPC APEX EXPO 2025: Highlighting Global PCB Trends and Technologies with all4-PCB

04/01/2025 | Real Time with...IPC APEX EXPO
Andy Shaughnessy and all4-PCB's Ralph Jacobo discuss global distribution trends in the PCB industry, focusing on new technologies in plasma etching and final inspection. Ralph highlights the importance of IC substrate buildup technology and partnerships in the market.

All4-PCB Announces New Partnership with USA Microcraft

02/09/2024 | all4-PCB
All4-PCB, a leading supplier of process solutions, equipment and consumables for PCB, LTCC, and CHEMICAL MILLING manufacturing industries, is excited to announce a partnership with USA Microcraft for Sales Support across North America.

all4-PCB Completes Pentagal HASL Installations

04/24/2023 | all4-PCB
all4-PCB, supplier of PCB process equipment to the North American market, has installed Penta Hot Air Solder Leveling (HASL) systems at Flexible Circuits and Jet Technologies.

Agfa Appoints all4-PCB as New Distributor of its PCB Solutions in Western USA, Canada

03/17/2021 | Agfa
Agfa announces the appointment of all4-PCB as their new distributor to handle their PCB Solutions product range in the Western USA and Canada regions. The agreement includes the distribution of Agfa’s IdeaLINE phototooling films and DiPaMAT inkjet inks used in the production of printed circuit boards and metal structuring applications.
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