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Register Now for NEDME 2024
September 11, 2024 | NEDMEEstimated reading time: 1 minute
The Northwest Electronics Design & Manufacturing Expo (NEDME) is back for another year of innovation, collaboration, and industry-leading insights. On Wednesday, October 30, 2024, join professionals from the electronics design and manufacturing sector at the Wingspan Event & Conference Center for a full day of cutting-edge exhibits, expert speakers, and unparalleled networking opportunities.
NEDME is the region’s largest event dedicated to advancing the electronics manufacturing industry. It’s your chance to connect with suppliers, industry leaders, and innovators who are driving the future of electronics design and manufacturing. Whether you’re involved in PCB design, product development, sourcing materials, or working in manufacturing operations, NEDME has something for you.
Highlights of NEDME 2024 Include:
- Exhibit Hall: Discover the latest products and services from vendors and suppliers, showcasing the newest technology and solutions.
- Keynote Speakers: Gain insights from top thought leaders in the industry as they share their expertise on current trends, challenges, and opportunities in electronics design and manufacturing.
- Technical Sessions & Workshops: Stay ahead of the curve with informative sessions covering a range of topics, in the design, manufacturing and business categories.
- Networking Opportunities: Meet and collaborate with peers, potential partners, and industry experts throughout the day.
Event Details:
- Date: Wednesday, October 30, 2024
- Time: 9:00 AM – 4:00 PM
- Location: Wingspan Event & Conference Center, 801 NE 34th Ave, Hillsboro, OR 97124
How to Register:
Attendee registration is now open! Secure your spot today by visiting www.nedme.com. Early registration is highly encouraged to get seats at your preferred sessions.
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Metcal Introduces New MicroFine Products for Soldering Under the Microscope
10/02/2024 | MetcalMetcal, part of OK International and Dover and a leader in benchtop soldering for electronics and industrial manufacturing, announced the launch of its new MicroFine soldering handpieces and cartridge tips for use under microscopes.
Silicon to Systems: Collaboration Between IC and PCB Design Continues
10/02/2024 | Andy Shaughnessy, Design007The walls are coming down between the designers of chips and PCBs. Because of the complexity of electronic systems, IC designers and PCB designers are increasingly finding themselves in need of information from technologists upstream and downstream, from silicon through the system level. Stephen Chavez, senior product marketing manager at Siemens, shares his thoughts on this silicon-to-systems approach and what it means for PCB designers, EDA tool providers, and system-level developers as well.
Northrop Grumman to Produce First Hypersonic Glide Phase Interceptor
09/30/2024 | Northrop GrummanThe U.S. Missile Defense Agency (MDA) will proceed with Northrop Grumman Corporation for the Glide Phase Interceptor (GPI) program, the first-of-its-kind defensive countermeasure against hypersonic missile threats. Working in close partnership with MDA, the three-year developmental effort produced a purpose-built, innovative design capable of defeating existing and emerging hypersonic threats.
Aismalibar to Showcase Thermal Management Solutions for EV Battery Systems at The Battery Show North America 2024
09/27/2024 | AismalibarAismalibar, a leader in innovative thermal management materials, will be presenting its newest solutions for electric vehicle (EV) battery systems at The Battery Show North America from October 7-11, 2024. Located at Huntington Place, Detroit, MI, Aismalibar will exhibit at booth 6231, unveiling a range of cutting-edge Thermal Interface Materials (TIMs) designed to improve the safety, performance, and longevity of EV batteries.