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This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
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Register Now for NEDME 2024
September 11, 2024 | NEDMEEstimated reading time: 1 minute
The Northwest Electronics Design & Manufacturing Expo (NEDME) is back for another year of innovation, collaboration, and industry-leading insights. On Wednesday, October 30, 2024, join professionals from the electronics design and manufacturing sector at the Wingspan Event & Conference Center for a full day of cutting-edge exhibits, expert speakers, and unparalleled networking opportunities.
NEDME is the region’s largest event dedicated to advancing the electronics manufacturing industry. It’s your chance to connect with suppliers, industry leaders, and innovators who are driving the future of electronics design and manufacturing. Whether you’re involved in PCB design, product development, sourcing materials, or working in manufacturing operations, NEDME has something for you.
Highlights of NEDME 2024 Include:
- Exhibit Hall: Discover the latest products and services from vendors and suppliers, showcasing the newest technology and solutions.
- Keynote Speakers: Gain insights from top thought leaders in the industry as they share their expertise on current trends, challenges, and opportunities in electronics design and manufacturing.
- Technical Sessions & Workshops: Stay ahead of the curve with informative sessions covering a range of topics, in the design, manufacturing and business categories.
- Networking Opportunities: Meet and collaborate with peers, potential partners, and industry experts throughout the day.
Event Details:
- Date: Wednesday, October 30, 2024
- Time: 9:00 AM – 4:00 PM
- Location: Wingspan Event & Conference Center, 801 NE 34th Ave, Hillsboro, OR 97124
How to Register:
Attendee registration is now open! Secure your spot today by visiting www.nedme.com. Early registration is highly encouraged to get seats at your preferred sessions.
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PCB Designers: ‘Level Up’ IC, Packaging Knowledge
09/16/2024 | Andy Shaughnessy, Design007 MagazineSoo Lan Cheah is kind of a unicorn in the industry. She is an IPC instructor based in Malaysia, and she has years of experience designing integrated circuits and printed circuit boards. I knew I had to get her thoughts for this issue on silicon-to-systems. I asked Soo Lan to discuss her cross-discipline background and what silicon-to-systems means to her.
IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges
09/16/2024 | IPCThe increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”
ASC Sunstone Circuits to Exhibit at the Anaheim Electronics & Manufacturing Show (AEMS) 2024
09/16/2024 | ASC SunstoneAmerican Standard Circuits | ASC Sunstone will be exhibiting at the Anaheim Electronics & Manufacturing Show 2024 to be held October 2-3 at the Anaheim Conventions Center in Anaheim, California.
Omni Design Technologies Partners with Aura Intelligent Systems on Next Generation Radar
09/16/2024 | BUSINESS WIREOmni Design Technologies, a leading provider of high-performance, low-power data acquisition and signal-processing solutions, and Aura Intelligent Systems, a developer of high-resolution imaging radar for ADAS and autonomous vehicles, announced a partnership on Aura’s next generation digital radar development.
Comtech Launches New Digital Common Ground Modem Product Line for DoD and Coalition Customers
09/13/2024 | BUSINESS WIREComtech, a global technology leader, today announced the launch of the Company’s new Digital Common Ground (“DCG”) portfolio of modems.