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AIM to Present on High Reliability and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Penang Expo & Tech Forum

08/30/2024 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Penang Expo & Tech Forum taking place September 25-26 at AC Hotel Penang in Malaysia.

Dana on Data: The Evolution of Fabrication Drawing

08/15/2024 | Dana Korf -- Column: Dana on Data
In June, IPC released an excellent white paper called “Next Generation Design Needs,” presenting the need for the transformation of disparate design tools and processes. It’s time to eliminate silos. This paper could have been released at any time since the 1990s since the fundamental challenge has not significantly improved. The accepted data transfer process assumes that the manufacturer will fix the design documentation so boards can be manufactured to meet the design, reliability, and cost requirements.

Elementary, Mr. Watson: Pushing Design Boundaries

05/29/2024 | John Watson -- Column: Elementary, Mr. Watson
Overconstraint: What a concept. Our first thoughts would be: What are we hurting by overconstraining a design? Isn't it better to be safe than sorry? What is meant by overconstraint? It means to apply excessive constraints. In engineering and mathematics, it's used when there are too many simultaneous equations to result in an exact solution. For example, fitting a line to many points is overconstrained because a line cannot be drawn simultaneously through all of the points. In PCB design, overconstraints always occur, including dimensional, electrical, manufacturing, and timing constraints. The list goes on.

Alternative Manufacturing Inc. Awarded QML Requalification to IPC J-STD-001 and IPC-A-610

04/24/2024 | IPC
IPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) requalification to Alternative Manufacturing Inc (AMI).

iNEMI Webinar: Humidity Robustness and Insulation Coordination for e-Mobility

03/27/2024 | iNEMI
This webinar is a follow-up to the recent Seminar on Humidity Robustness and Insulation Coordination for e-Mobility, organized by iNEMI and ZESTRON Europe and supported by the ECPE.
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