-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSolder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
A Culture of Thriving
One cannot simply command thriving; it must be nurtured, developed, and encouraged. In this issue, we explore strategies to improve your working relationship model—both internally and externally. In this culture of thriving, your business will grow in the process.
Certifications
Certifications have historically been seen as a cost of doing business, but how do we turn them into a positive ROI and a value to both customer and vendor?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges
September 16, 2024 | IPCEstimated reading time: 1 minute
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”
The white paper explores the packaging and integration needs for several key application areas:
- High Performance Computing (HPC)
- 5G/6G Wireless Communications
- Autonomous Driving and Electric Vehicles (EV)
- Medical Electronics
- Aerospace & Defense Electronics
The paper then analyzes the following aspects of advanced packaging to board-level integration:
- Design challenges and co-design approaches
- Power delivery requirements
- Thermal management challenges
- Materials innovation needs for package assembly and PCB integration
- Printed Circuit Board Assembly (PCBA) challenges
- Reliability considerations for heterogeneously integrated systems
- Metrology requirements for the characterization of advanced packaging to board level assembly
The white paper emphasizes the importance of a “silicon to systems” approach in developing next-generation chiplet-based advanced packages and their integration into complex systems. The paper also recommends the development of a 5-10 year outlook on trends, challenges, and gaps in advanced electronic packaging and PCB/subsystem integration across various application domains. This roadmap will enable the electronics industry supply chain to better prepare for and address the complex challenges in system-level packaging and integration.
“IPC is committed to identifying the gaps and challenges in design, materials, assembly, test, and reliability as applied to advanced packaging integration with printed circuit boards, assemblies, and subsystems,” said Devan Iyer, chief strategist advanced packaging and white paper co-author. “Along with our industry partners, IPC will continue to be the leading advocate of a ‘silicon-to-systems’ approach as the evolution of advanced packaging directly affects the future of all aspects of electronics manufacturing,” emphasized Matt Kelly, IPC chief technology officer and white paper co-author.
This white paper provides valuable insights for anyone involved in electronics manufacturing, helping them stay ahead of technological trends and address future integration challenges effectively. Download the White Paper.
Suggested Items
Elementary, Mr. Watson: The Paradigm Shift of Silicon-to-System Design
09/18/2024 | John Watson -- Column: Elementary, Mr. WatsonImagine you were asked to build a city. What approach would you take? In the old way, city planners designed each building independently. They focused on making each building strong, aesthetically pleasing, and valuable. But they didn't always consider how all the buildings would fit together in the city. Roads, power lines, and parks were added later, sometimes making the city confusing or complicated to get around.
From Silicon to Systems
09/10/2024 | Andy Shaughnessy, Design007 MagazineFor the past few years, IPC has been championing the term “silicon to systems.” More than a buzzword, it has become a slogan—and even a kind of roadmap—for the organization. The term comes in especially handy when IPC is advocating for this industry in Washington, D.C., often addressing politicians who have little understanding of electronics technology.
CoWoS Drives Demand for Advanced Packaging Equipment; Sales Expected to Surpass 10% Growth in 2024
08/29/2024 | TrendForceTrendForce reveals that sales of advanced packaging equipment are expected to grow by more than 10% in 2024, with the potential to exceed 20% in 2025.
Nordson Electronics Solutions to Exhibit at SEMICON Taiwan 2024
08/28/2024 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in electronics manufacturing technologies, will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan tradeshow, booth L0516.
Why You Need to Take This New ‘Semiconductor Essentials’ Course
08/26/2024 | I-Connect007 Editorial TeamRecently, Andy Shaughnessy and Nolan Johnson met with Soo Lan Cheah, the developer of a new IPC course geared toward PCB manufacturing professionals who have little to no knowledge about semiconductor manufacturing. With her background in PCB and IC design, Soo Lan brings a circumspect vision of these disciplines and how they are inter-related. You don’t need to know a lot of math to take this course, and you’ll come out with a much better understanding of the whole silicon-to-systems approach.