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Trans-Tec America, in Partnership with Yamaha Robotics USA, will exhibit dynamic SMT assembly technologies at the SMTAI 2024 trade show and conference, October 20 - 24, 2024 at the Donald E. Stephens Convention Center in Rosemont, IL, USA.
On exhibit will be the YRM20-2 modular surface mounter, which brings the best of all worlds for optimum productivity. It’s a proven performer, able to excel at a wide range of production processes while still being the one of the world’s fastest mounters in its class.
The YRM20 modular mounter is based on the one-head solution concept that allows high speed placement of a wide range of component sizes.
With this machine, gantry speeds and placement optimizations have been increased to achieve a mounting speed of up to 115,000 chips per hour (cph): one of industry’s fastest in the two-beam / two-head class category. In addition, its RM Rotary Head can simultaneously pick from 2 separate feeders, dramatically improving productivity.
Trans-Tec will also exhibit Yamaha’s YRP10 Solder Paste Printer. With this addition to the new “YR” Series of machines, Yamaha has achieved the highest level of printing accuracy in the industry with excellent dynamic rigidity as well as the “3S head”, a programmable angle single squeegee head which controls the attack angle, speed, and printing application force with a single squeegee.
In the efforts to remove unnecessary operator interaction with the machine, the YRP10’s automatic support pin setup and solder / stencil replacement option greatly reduces labor and human error when changing out products. Additionally, dual-lane compatibility enables completely independent operation, as each lane can be selected to flexibly support a wide range of diverse products and production formats.
Trans-Tec will also showcase the YRiV 3D/4D Automatic Optical Inspector (AOI), which uses a new stopper-less transfer system, dramatically lessening the time normally needed to position the assembly for inspection. The cumulative time saving accelerates the completion of every batch and significantly increases overall productivity.
Additionally, the new multi-component alignment check simplifies programming the YRi-V to measure the distances between arrayed parts such as LED emitters in automotive or general lighting. When building automotive headlamps, users can leverage the captured AOI data to individually optimize the placement of beam-focusing lenses for maximum lighting performance. The alignment check can be used to verify the spacings between many other types of components, such as Hall sensors for precision motion control.
Lastly, the upgraded height measurement system, using a blue laser, ensures accurate and repeatable measurements for components that are difficult to capture with standard equipment.
Show visitors can stop by the booth to set up appointments for individual equipment demonstrations.
