I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 20, 2024 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes

It’s been a busy week in the world of PCB design and manufacturing. In this week’s roundup, there’s a little bit of everything. We have a look at PCB technology of tomorrow, an interview with an engineer who designs both PCBs and ICs, and government relations news from Washington, D.C. We also have an article on dispensing technology, and a final installment of our podcast on “designing for reality.”
Fall is here, and I for one am glad it’s not 97 degrees anymore. I’m heading out to the Anaheim Electronics and Manufacturing Show and PCB West (AEMS), a new event by the same people who run the Del Mar Electronics Show near San Diego. I hope to see you at a show!
Global Perspectives: The Future of PCB Technology
Published September 18
Marcy LaRont brings us a great interview with Joe Dickson, a senior vice president at Wus Printed Circuit Co. Ltd., and one of the foremost experts on advanced PCB technologies. In this conversation, Joe discusses the trends he’s seeing in PCB fabrication around the globe, and he explains some new processes used at Wus, including additive circuitry carrier processing, also called “known good layers.” Check it out.
PCB Designers: ‘Level Up’ IC, Packaging Knowledge
Published September 16
Chip design and PCB design have been separate disciplines for decades. But we’re starting to see a blurring of the lines between these camps. In this interview, Soo Lan Cheah discusses the silicon-to-systems concept and what she’s learned over the years designing integrated circuits and printed circuit boards. Are PCB designers of the future going to be trained in chip design, and vice versa?
The Government Circuit: News on Defense Electronics, Europe, and Sustainability
Published September 17
I grew up five miles from Washington, D.C. This area was a swamp when Pierre L’Enfant laid out the city 200 years ago. Well, in some ways, it’s still a swamp, and IPC’s Chris Mitchell has the unenviable job of keeping an eye on the politicians and bureaucrats there. Some of our elected officials will “spit” in your ear and tell you it’s rain, especially in an election year. In his latest column, Chris provides updates on plans for government investment in the PCB community, particularly in defense, and a variety of electronics industry resolutions working their way through Congress. Always a good read.
Auguring in on Dispensing
Published September 19
Dispensing isn’t one of the more exciting operations in PCB assembly, but there have been a number of innovations in this field, particularly in the past few decades. In this conversation, Sunny Agarwal of Camalot Dispensers R&D breaks down some of the advances in dispensing technology since the 1990s, such as jet dispensers, as well as strategies like their CBI (customer-based innovation) model.
Routing, Final Fab, and QC: Don’t Miss the Final Episode of On the Line With… Designing for Reality
Published September 19
If you’re a regular reader, you’ve probably been following our podcast On the Line With… Designing for Reality. In this final installment of the series, Matt Stevenson of ASC Sunstone walks us through the last stages of PCB manufacturing, specifically from a “designing for reality” viewpoint. If we’re not designing for reality, we will have problems.
Suggested Items
OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment
04/28/2025 | BUSINESS WIREOKI Circuit Technology, the OKI Group printed circuit board (PCB) company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors.
North American PCB Industry Shipments Down 3.1% in March
04/28/2025 | IPCIPC announced the March 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.24.
Candor Elevates PCB Fabrication Services with Continued Facility Upgrades
04/28/2025 | Candor CircuitsOntario-based circuit board manufacturer, Candor Circuit Boards has recently completed a series of facility upgrades to improve their PCB offerings. These investments will allow Candor to provide higher volumes of complicated boards more efficiently with better yield. The new technology has allowed the company to take on exciting high technology projects and collaborations in industries such as Military and Aerospace, Medical, Energy and more.
LITEON, Elephantech Deepen Partnership to Further Drive Innovation and End-to-End Sustainability
04/24/2025 | LITEON TechnologyLITEON Technology has signed a second Memorandum of Understanding (MoU) with Elephantech, deepening their strategic partnership in advancing green Printed Circuit Boards (PCB) manufacturing. Announced on Earth Day (April 22), the renewed collaboration highlights their joint commitment to achieving net-zero carbon emissions.
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
04/24/2025 | John Watson -- Column: Elementary, Mr. WatsonOn a flight, I can always tell when we begin our descent because that subtle drop in my stomach tells me the altitude has changed. Landing an airplane involves a gradual, precise process called the glide path. It descends at the correct speed and 3-degree angle to touch down smoothly and safely on the runway without bouncing or coming to a sudden stop. Pilots use specialized tools like the Instrument Landing System (ILS) or GPS to stay on the correct path. Lights on the ground, called PAPI lights, help pilots know if they are too high or too low.