-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
SMTA Carolinas Chapter Hosts Expert-Led Webinar: “Mastering Solder Paste Printing for Optimal SMT Assembly”
September 24, 2024 | Koh YoungEstimated reading time: 1 minute
The SMTA Carolinas Chapter invites you to attend an informative webinar on "Mastering Solder Paste Printing for Optimal SMT Assembly" on Tuesday, October 15, 2024, from 12:00 PM to 1:00 PM (Eastern). This virtual session will be presented by Chris Dayney, Eastern Regional Sales Manager at Fuji America Corporation, an expert with nearly 30 years of experience in the SMT industry.
In this session, Chris Dayney will provide valuable insights into the critical role of solder paste printing in the SMT process. Attendees will gain a comprehensive understanding of key process parameters, equipment setup, common failures, and strategies to mitigate them. The presentation will demonstrate how mastering the solder paste printing process enhances line efficiency, reliability, and overall product quality in SMT assembly.
Chris Dayney is the Eastern Regional Sales Manager for Fuji America Corporation, headquartered in Vernon Hills, IL. Based in Crossville, TN, Chris brings a wealth of experience to the SMT industry, having honed his expertise through various roles at Fuji, including as an Instructor and Training Team Leader. His background also includes time at Siemens Energy and Automation, where he further expanded his technical knowledge. A dedicated serviceman, Chris proudly served 12 years in the U.S. Navy and 8 years in the Army National Guard. He holds a Bachelor's degree in Education from Southern Illinois University and an Associate's degree in Electronics from the University of Phoenix, combining both technical and educational expertise to provide outstanding support to his customers.
Suggested Items
Nano Dimension’s Additive Electronics Product Line - Essemtec - Received a Global Technology Award
12/11/2024 | Nano DimensionNano Dimension Ltd, a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (AM) 3D printing solutions, announced that its Tarantula Underfill system from its Essemtec product lines received the Global Technology Award for Innovation at the SMTA International 2024 Show in Chicago, Illinois.
Real Time with... electronica 2024: Revolutionizing Inspection—Delvitech AI Innovations
12/02/2024 | Real Time with... electronicaPete Starkey Interviews Roberto Gatti, chief executive officer of Delvitech, which specializes in 3D automated optical inspection using advanced artificial intelligence. Founded in 2018, the company stands out by integrating AI with high-end hardware to enhance inspection capabilities. Its neural networks mimic human brain functions, improving results over time.
Würth Elektronik Improves and Expands its Balun Series
11/27/2024 | Wurth Elektronik eiSosWürth Elektronik has expanded its WE-BAL series of baluns. The components for coupling symmetrical and asymmetrical transmission lines feature improved materials and manufacturing processes, and now cover wider frequency ranges from 673 MHz to 5900 MHz.
CIL Installs Third Volume Auto SMT Line with In-Line 3D AOI at BP2 Facility
11/25/2024 | CILIn early November 2024, CIL completed the installation of its third volume SMT PCBA assembly line at its BP2 Semiconductor Packaging facility
Sat Nusapersada Chooses Siemens' Process Preparation Software to Boost NPI and SMT Line Efficiency
11/21/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software announced that Sat Nusapersada, one of the largest Electronics Manufacturing Services (EMS) providers in Indonesia, has adopted its Process Preparation software to reduce its timescale for New Product Introduction (NPI) of printed circuit board assemblies and improve the efficiency of its Surface Mount Technology production lines by 23 percent.