Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

YINCAE's TM230D Introduced: Innovative 3-in-1 Solderable Adhesive

03/06/2026 | YINCAE
A breakthrough in advanced packaging materials has arrived with the introduction of TM230D, an innovative 3-in-1 sintering material designed to simplify processing while delivering exceptional thermal & reliability performance for next-generation power electronics & high-performance semiconductor applications.

Kurtz Ersa Goes Semiconductor: Expanding Competence in Microelectronics & Advanced Packaging

03/06/2026 | Kurtz Ersa Corp.
Kurtz Ersa Inc. is strengthening its position in microelectronics and semiconductor technology. Effective September 1, 2025, ATV Technologie GmbH officially became part of the Kurtz Ersa Group and will operate under the new name Kurtz Ersa Semicon GmbH.

Indium to Feature High-Reliability Liquid Metal Technology at SEMI-THERM 2026

03/02/2026 | Indium Corporation
Indium Corporation® will highlight high-reliability liquid metal technology and metal thermal interface material (TIM) products at SEMI-THERM 2026, March 9-12, in San Jose, California.

Indium to Discuss Oxidation Control for High-Performance Indium at SEMI-THERM 2026

02/26/2026 | Indium Corporation
Indium Corporation® Product Manager, Engineered Solder Materials (ESM), Jim McCoy, will present techniques to minimize oxidation and improve the thermal conductivity and performance of pure indium at SEMI-THERM 2026, taking place March 9-12 in San Jose, California.

Vinci Ships Production-Grade Thermo-Mechanical Simulation at Manufacturing Scale

02/25/2026 | BUSINESS WIRE
Vinci announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs: how they bend, twist, and deform under real-world thermal conditions.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in