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Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
Designing Proper Work-Life Balance
In this issue, we hear from designers, marketers, and business owners on how they apply their professional skills to their personal lives to build a healthier work-life balance.
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New Episode of NCAB Podcast Series Explores Cutting-edge Thermal Management Solutions
May 14, 2025 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is excited to share the latest episode of our new podcast series, which delivers expert technical insights for the printed circuit board and electronics manufacturing industry.
In this episode of On the Line with... NCAB: PCB Thermal Management, we continue the conversation with NCAB Field Application Engineer Ryan Miller as we dive into practical design and manufacturing techniques for controlling thermal effects. Topics include via farms, insulated metal substrates, coin technology, and copper pedestals—solutions that help meet today's high-performance demands.
As the industry’s longest-running digital media company, I-Connect007 delivers the original content you need—magazines, books, in-depth features, newsletters, podcasts, webinars, and event coverage—to keep you informed and ahead of the curve.
Don’t miss Episode 3 of this insightful series—and be sure to download the free companion guide!
Learn about this and many other topics by visiting I-007e Educational Resource Center.
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Rachael Temple - AlltematedSuggested Items
YINCAE's TM230D Introduced: Innovative 3-in-1 Solderable Adhesive
03/06/2026 | YINCAEA breakthrough in advanced packaging materials has arrived with the introduction of TM230D, an innovative 3-in-1 sintering material designed to simplify processing while delivering exceptional thermal & reliability performance for next-generation power electronics & high-performance semiconductor applications.
Kurtz Ersa Goes Semiconductor: Expanding Competence in Microelectronics & Advanced Packaging
03/06/2026 | Kurtz Ersa Corp.Kurtz Ersa Inc. is strengthening its position in microelectronics and semiconductor technology. Effective September 1, 2025, ATV Technologie GmbH officially became part of the Kurtz Ersa Group and will operate under the new name Kurtz Ersa Semicon GmbH.
Indium to Feature High-Reliability Liquid Metal Technology at SEMI-THERM 2026
03/02/2026 | Indium CorporationIndium Corporation® will highlight high-reliability liquid metal technology and metal thermal interface material (TIM) products at SEMI-THERM 2026, March 9-12, in San Jose, California.
Indium to Discuss Oxidation Control for High-Performance Indium at SEMI-THERM 2026
02/26/2026 | Indium CorporationIndium Corporation® Product Manager, Engineered Solder Materials (ESM), Jim McCoy, will present techniques to minimize oxidation and improve the thermal conductivity and performance of pure indium at SEMI-THERM 2026, taking place March 9-12 in San Jose, California.
Vinci Ships Production-Grade Thermo-Mechanical Simulation at Manufacturing Scale
02/25/2026 | BUSINESS WIREVinci announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs: how they bend, twist, and deform under real-world thermal conditions.