Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Nolan’s Notes: Soldering Technologies
Altus Group Introduces Innovative BGA Reballing Solution to Meet Growing Sustainability Demands
September 25, 2024 | Altus GroupEstimated reading time: 1 minute
Altus Group, a leading distributor of capital equipment in the UK and Ireland, has introduced an advanced BGA re-balling solution to address the electronics industry's growing focus on sustainability and cost-efficiency. Developed by their pre-eminent supplier, Essemtec, this innovative process offers manufacturers a new approach to component recovery and reuse, aligning with increasing market demands for environmentally conscious practices.
Building on their expertise in adaptive SMT equipment, Essemtec has designed a cutting-edge BGA re-balling process that consolidates flux deposition, ball placement, and soldering into a single streamlined solution. This all-in-one approach is particularly advantageous for high-volume OEMs and companies in sectors such as military, aerospace, computing, and communication, providing a cost-effective and sustainable method for component recovery and reuse.
Jiri Kucera, Operations Director at Altus Group, said: "Reworking BGAs, recovery of expensive parts, and re-use is becoming a highly discussed topic across the electronics industry as consumers become more interested in sustainability. This is another example of Essemtec developing a process to meet the needs of the market."
The new robotic process offers several advantages over traditional manual methods:
1. Increased precision and reliability.
2. Support for various ball sizes (250 µm to 1 mm+) and materials.
3. Improved success rates compared to manual stencil techniques.
4. Cost-effective reuse of expensive BGA components.
Jiri added, "Companies are already using the Essemtec jetting unit for BGA re-balling across a range of pitched components, giving partners the power to bring some of the recovery processes back in-house rather than outsource to partners at a higher cost."
This solution is particularly relevant for organisations prioritising environmental impact and sustainability. By extending the lifecycle of electronic components, the process contributes to waste reduction and promotes a more circular economy in electronics manufacturing.
Altus sees this technology as a significant step in meeting the electronic industry's evolving needs. As sustainability continues to gain importance, solutions like this will play a crucial role in shaping the future of electronics manufacturing and repair.
Share on:
Suggested Items
Statistically Testing Inner Layer Yield Improvement Projects
12/18/2024 | Dr. Patrick Valentine, UyemuraCan we trust our measurement system to give us reliable data? Is it accurate, repeatable, and reproducible? Measurement is the foundation of quality. We measure for two primary reasons: to make decisions on product quality and to provide data that will inform continuous improvement projects. We can engage in continuous improvement projects if we are confident in our measurement systems.
SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition
12/16/2024 | SCHMID GroupThe SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition.
ASMPT: Backchannel Production Planning in Electronics Manufacturing with WORKS
12/16/2024 | ASMPTThe WORKS Software Suite from ASMPT raises production planning in electronics manufacturing to a new level. With its seamless integration of ERP systems and continuous data feedback loop, the software optimizes the planning process in real time – from receiving an order to starting its production run.
Successful Pre-acceptance of TSK Schill GmbH Production Line for Moulded Etched Parts
12/16/2024 | TSK Schill GmbHThe specialist for horizontal wet systems for the production of printed circuit boards, chemical milling and moulded etched parts, TSK Schill GmbH from Gäufelden-Nebringen, is installing new production systems at one of the leading manufacturers of precision metal parts.
Inner Layer Precision & Yields Explored in December 2024 Issue of PCB007 Magazine
12/16/2024 | I-Connect007 Editorial TeamBuilding accuracy into your inner layers as well as being able to assess their pass/fail status as early as possible is critical. In this month’s PCB007 Magazine, we take a close look at building precision into your inner layers.