-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSupply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Altus Group Introduces Innovative BGA Reballing Solution to Meet Growing Sustainability Demands
September 25, 2024 | Altus GroupEstimated reading time: 1 minute

Altus Group, a leading distributor of capital equipment in the UK and Ireland, has introduced an advanced BGA re-balling solution to address the electronics industry's growing focus on sustainability and cost-efficiency. Developed by their pre-eminent supplier, Essemtec, this innovative process offers manufacturers a new approach to component recovery and reuse, aligning with increasing market demands for environmentally conscious practices.
Building on their expertise in adaptive SMT equipment, Essemtec has designed a cutting-edge BGA re-balling process that consolidates flux deposition, ball placement, and soldering into a single streamlined solution. This all-in-one approach is particularly advantageous for high-volume OEMs and companies in sectors such as military, aerospace, computing, and communication, providing a cost-effective and sustainable method for component recovery and reuse.
Jiri Kucera, Operations Director at Altus Group, said: "Reworking BGAs, recovery of expensive parts, and re-use is becoming a highly discussed topic across the electronics industry as consumers become more interested in sustainability. This is another example of Essemtec developing a process to meet the needs of the market."
The new robotic process offers several advantages over traditional manual methods:
1. Increased precision and reliability.
2. Support for various ball sizes (250 µm to 1 mm+) and materials.
3. Improved success rates compared to manual stencil techniques.
4. Cost-effective reuse of expensive BGA components.
Jiri added, "Companies are already using the Essemtec jetting unit for BGA re-balling across a range of pitched components, giving partners the power to bring some of the recovery processes back in-house rather than outsource to partners at a higher cost."
This solution is particularly relevant for organisations prioritising environmental impact and sustainability. By extending the lifecycle of electronic components, the process contributes to waste reduction and promotes a more circular economy in electronics manufacturing.
Altus sees this technology as a significant step in meeting the electronic industry's evolving needs. As sustainability continues to gain importance, solutions like this will play a crucial role in shaping the future of electronics manufacturing and repair.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
The Art and Science of PCB Floor Planning: A Comprehensive Guide
08/14/2025 | Cory Grunwald and Jeff Reinhold, Monsoon SolutionsPCB design is an intricate and crucial part of developing electronic products. One of the foundational stages of PCB design is floor planning, a phase where the placement of components and the flow of signals are meticulously mapped out. A good floor plan ensures that the PCB performs well, is easy to manufacture, and meets all mechanical and electrical requirements. We’ll explore the essential aspects of floor planning, from its objectives and process to the challenges that designers face.
Advint and SanRex Expand High-Performance DC Rectifier Access for North American PCB Fabricators
08/12/2025 | Advint IncorporatedAdvint Incorporated has entered a strategic partnership with SanRex Corporation, enhancing access to industrial-grade DC rectifiers for the US printed circuit board industry. With a legacy of power innovation and performance across the globe, SanRex rectifiers are available through Advint’s proficient distribution network.
Advint and Sayron Bring Advanced Rectifier Solutions to High-Reliability PCB Manufacturers
08/01/2025 | Advint IncorporatedAdvint Incorporated has partnered with Sayron, a leading global rectifier manufacturer, to supply cutting-edge IGBT-based DC rectifiers to high-performance PCB manufacturers across North America and beyond. Sayron’s precision-engineered rectifiers align with the stringent requirements of advanced PCB processes.
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
08/04/2025 | Michael Carano -- Column: Trouble in Your TankMetallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.
Magnalytix’s Dr. Mike Bixenman to Guide PDC at SMTA High-Reliability Cleaning and Conformal Coating Conference
07/31/2025 | MAGNALYTIXMagnalytix, providing real-time reliability solutions for electronics manufacturing, is excited to announce that Dr. Mike Bixenman will present the professional development course “The Effects of Flux Residues and Process Contamination on the Reliability of the Electronic Assembly” on Wednesday, Aug. 13 at 9:00 AM CST to open the second day of the STMA High-Reliability Cleaning and Conformal Coating Conference.