Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
Altus Group Introduces Innovative BGA Reballing Solution to Meet Growing Sustainability Demands
September 25, 2024 | Altus GroupEstimated reading time: 1 minute
Altus Group, a leading distributor of capital equipment in the UK and Ireland, has introduced an advanced BGA re-balling solution to address the electronics industry's growing focus on sustainability and cost-efficiency. Developed by their pre-eminent supplier, Essemtec, this innovative process offers manufacturers a new approach to component recovery and reuse, aligning with increasing market demands for environmentally conscious practices.
Building on their expertise in adaptive SMT equipment, Essemtec has designed a cutting-edge BGA re-balling process that consolidates flux deposition, ball placement, and soldering into a single streamlined solution. This all-in-one approach is particularly advantageous for high-volume OEMs and companies in sectors such as military, aerospace, computing, and communication, providing a cost-effective and sustainable method for component recovery and reuse.
Jiri Kucera, Operations Director at Altus Group, said: "Reworking BGAs, recovery of expensive parts, and re-use is becoming a highly discussed topic across the electronics industry as consumers become more interested in sustainability. This is another example of Essemtec developing a process to meet the needs of the market."
The new robotic process offers several advantages over traditional manual methods:
1. Increased precision and reliability.
2. Support for various ball sizes (250 µm to 1 mm+) and materials.
3. Improved success rates compared to manual stencil techniques.
4. Cost-effective reuse of expensive BGA components.
Jiri added, "Companies are already using the Essemtec jetting unit for BGA re-balling across a range of pitched components, giving partners the power to bring some of the recovery processes back in-house rather than outsource to partners at a higher cost."
This solution is particularly relevant for organisations prioritising environmental impact and sustainability. By extending the lifecycle of electronic components, the process contributes to waste reduction and promotes a more circular economy in electronics manufacturing.
Altus sees this technology as a significant step in meeting the electronic industry's evolving needs. As sustainability continues to gain importance, solutions like this will play a crucial role in shaping the future of electronics manufacturing and repair.
Share on:
Suggested Items
Rules of Thumb for PCB Layout
11/21/2024 | Andy Shaughnessy, I-Connect007The dictionary defines a “rule of thumb” as “a broadly accurate guide or principle, based on experience or practice rather than theory.” Rules of thumb are often the foundation of a PCB designer’s thought process when tackling a layout. Ultimately, a product spec or design guideline will provide the detailed design guidance, but rules of thumb can help to provide the general guidance that will help to streamline the layout process and avoid design or manufacturing issues.
Sat Nusapersada Chooses Siemens' Process Preparation Software to Boost NPI and SMT Line Efficiency
11/21/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software announced that Sat Nusapersada, one of the largest Electronics Manufacturing Services (EMS) providers in Indonesia, has adopted its Process Preparation software to reduce its timescale for New Product Introduction (NPI) of printed circuit board assemblies and improve the efficiency of its Surface Mount Technology production lines by 23 percent.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
PI's New Expansion for Higher Electronics Manufacturing Capacities and Shorter Lead Times
11/20/2024 | PRNewswirePI, the market and technology leader for high-precision motion control, positioning technology, and piezo applications, has completed the construction of additional electronics production space at its Rosenheim, Germany site.
Infineon, Quantinuum Partner to Accelerate Quantum Computing Towards Meaningful Real-world Applications
11/20/2024 | InfineonInfineon Technologies AG, a global leader in semiconductor solutions, and Quantinuum, a global leader in integrated, full-stack quantum computing, today announced a strategic partnership to develop the future generation of ion traps.