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EMA Webinar: Maximize Your Design Productivity in OrCAD X and Allegro X
September 26, 2024 | EMA Design AutomationEstimated reading time: Less than a minute
Learn how the extensible environment in Cadence OrCAD X and Allegro X is being used to enhance and customize the PCB design flow in a webinar held by EMA on Tuesday, October 1st, 2024 @ 11am ET.
What You Will Learn:
- See how the powerful SKILL framework in PCB Editor can be used to create countless time-saving routines and utilities.
- Explore how you can leverage pre-build utilities designed to drastically improve your productivity
- Learn how you can speed up tedious yet important tasks like documentation and drafting as well as integrate support for newer technologies like stretch flex and AOI technologies
- Explore around 50 FloWare utilities built to help you get more done faster
Join special guest, Rolf Nick from FlowCAD.
Visit the EMA Acadamy webpage to learn more and register for the event.
Suggested Items
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
Sikorsky to Demonstrate Flight Autonomy to U.S. Marine Corps
12/16/2024 | Lockheed MartinSikorsky, a Lockheed Martin company has been selected by the U.S. Marine Corps to demonstrate the maturity and capability of the MATRIX™ flight autonomy system.
Nano Dimension’s Additive Electronics Product Line - Essemtec - Received a Global Technology Award
12/11/2024 | Nano DimensionNano Dimension Ltd, a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (AM) 3D printing solutions, announced that its Tarantula Underfill system from its Essemtec product lines received the Global Technology Award for Innovation at the SMTA International 2024 Show in Chicago, Illinois.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
SEMI ISS Europe 2025 to Spotlight AI as a Catalyst for Europe’s Competitiveness and Innovation
12/11/2024 | SEMILeading industry experts, economists, policymakers, and technology leaders will gather at the SEMI Industry Strategy Symposium Europe (ISS Europe) 2025, March 12-14 in Sopot, Poland, to explore the transformative role of Artificial Intelligence in driving Europe’s semiconductor industry forward.