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This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
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In this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value.
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Our expert contributors discuss the advent of mechatronics in PCB design, the challenges and opportunities this creates for circuit board designers, and the benefits—to the employee and the company—of becoming a mechatronics engineer.
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EMA Webinar: Maximize Your Design Productivity in OrCAD X and Allegro X
September 26, 2024 | EMA Design AutomationEstimated reading time: Less than a minute
Learn how the extensible environment in Cadence OrCAD X and Allegro X is being used to enhance and customize the PCB design flow in a webinar held by EMA on Tuesday, October 1st, 2024 @ 11am ET.
What You Will Learn:
- See how the powerful SKILL framework in PCB Editor can be used to create countless time-saving routines and utilities.
- Explore how you can leverage pre-build utilities designed to drastically improve your productivity
- Learn how you can speed up tedious yet important tasks like documentation and drafting as well as integrate support for newer technologies like stretch flex and AOI technologies
- Explore around 50 FloWare utilities built to help you get more done faster
Join special guest, Rolf Nick from FlowCAD.
Visit the EMA Acadamy webpage to learn more and register for the event.
Suggested Items
Explore Advanced Coating Solutions for Electronics at SMTA International 2024
10/03/2024 | ECTEngineers and electronics professionals attending SMTA International 2024 are invited to visit booth 2713, where Electronic Coating Technologies (ECT) will present solutions for protecting and enhancing the durability of electronic assemblies. In collaboration with Dymax.
PCB Surface Topography and Copper Balancing Under Large Form Factor BGAs
10/01/2024 | Neil Hubble, Akrometrix and Gary A. Brist, Intel CorporationAs CPU and GPU packages grow larger and contain higher pin/ball counts, the importance of managing the printed circuit board (PCB) surface coplanarity for package assembly increases. The PCB surface coplanarity under a package is a product of both the global bow/twist of the PCB and the local surface topography under the package. In general, the surface topography is dependent the choice of material and layer stackup and the interaction between the innerlayer copper patterns and prepreg resin flow.
American Standard Circuits to Exhibit at SMTA International Conference and Expo
09/26/2024 | American Standard CircuitsAmerican Standard Sunstone Circuits will be exhibiting at SMTA International 2024, Oct. 22-24, at the Donald E. Stephens Convention Center in Rosemont, Illinois.
Connect the Dots: Designing for Reality—Outer Layer Imaging
09/26/2024 | Matt Stevenson -- Column: Connect the DotsWelcome to the next step in the manufacturing process—the one that gets the chemical engineer in all of us excited. I am referring to outer layer imaging, or how we convert digital designs to physical products. On a recent episode of I-Connect007’s On the Line with… podcast, we explained how the outer layer imaging process maps the design’s unique features onto the board.
Würth Elektronik at electronica 2024
09/25/2024 | Wurth ElectronicsWürth Elektronik is exhibiting at electronica – the leading international trade show – in Munich, November 12-15, 2024.