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Explore Advanced Coating Solutions for Electronics at SMTA International 2024

10/03/2024 | ECT
Engineers and electronics professionals attending SMTA International 2024 are invited to visit booth 2713, where Electronic Coating Technologies (ECT) will present solutions for protecting and enhancing the durability of electronic assemblies. In collaboration with Dymax.

PCB Surface Topography and Copper Balancing Under Large Form Factor BGAs

10/01/2024 | Neil Hubble, Akrometrix and Gary A. Brist, Intel Corporation
As CPU and GPU packages grow larger and contain higher pin/ball counts, the importance of managing the printed circuit board (PCB) surface coplanarity for package assembly increases. The PCB surface coplanarity under a package is a product of both the global bow/twist of the PCB and the local surface topography under the package. In general, the surface topography is dependent the choice of material and layer stackup and the interaction between the innerlayer copper patterns and prepreg resin flow.

American Standard Circuits to Exhibit at SMTA International Conference and Expo

09/26/2024 | American Standard Circuits
American Standard Sunstone Circuits will be exhibiting at SMTA International 2024, Oct. 22-24, at the Donald E. Stephens Convention Center in Rosemont, Illinois.

Connect the Dots: Designing for Reality—Outer Layer Imaging

09/26/2024 | Matt Stevenson -- Column: Connect the Dots
Welcome to the next step in the manufacturing process—the one that gets the chemical engineer in all of us excited. I am referring to outer layer imaging, or how we convert digital designs to physical products. On a recent episode of I-Connect007’s On the Line with… podcast, we explained how the outer layer imaging process maps the design’s unique features onto the board.

Würth Elektronik at electronica 2024

09/25/2024 | Wurth Electronics
Würth Elektronik is exhibiting at electronica – the leading international trade show – in Munich, November 12-15, 2024.
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