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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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EMA Webinar: Maximize Your Design Productivity in OrCAD X and Allegro X
September 26, 2024 | EMA Design AutomationEstimated reading time: Less than a minute
Learn how the extensible environment in Cadence OrCAD X and Allegro X is being used to enhance and customize the PCB design flow in a webinar held by EMA on Tuesday, October 1st, 2024 @ 11am ET.
What You Will Learn:
- See how the powerful SKILL framework in PCB Editor can be used to create countless time-saving routines and utilities.
- Explore how you can leverage pre-build utilities designed to drastically improve your productivity
- Learn how you can speed up tedious yet important tasks like documentation and drafting as well as integrate support for newer technologies like stretch flex and AOI technologies
- Explore around 50 FloWare utilities built to help you get more done faster
Join special guest, Rolf Nick from FlowCAD.
Visit the EMA Acadamy webpage to learn more and register for the event.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
It’s Only Common Sense: Customers Capabilities—and Confidence
04/20/2026 | Dan Beaulieu -- Column: It's Only Common SenseI’ve been around, man! I’ve been in enough conference rooms, factory floors, and late-night airport lounges to know one thing for certain: Most companies think they lose business because they lack capability. They don’t. They lose business because they fail to inspire confidence.
AGC's Advanced PCB Material Solutions
04/17/2026 | Real Time with... APEX EXPOAGC's line includes advanced PCB materials for critical industries such as aerospace, defense, and medical. This interview highlights their commitment to North American sourcing, offering solutions to today's challenges. AGC provides specialized automotive PCB materials including fastRise, a low-loss non-reinforced prepreg designed for high-frequency applications like 77 GHz radar.
A 60-Year Legacy of PCB Innovation from IEC
04/17/2026 | Real Time with... APEX EXPOChris Hrusovsky, director of business development for International Electronic Components (IEC), shares his company’s commitment to customer partnerships, seamless service, and technical support for fabricators. Chris updates us on technological advancements in direct imaging, copper-filled vias, and the company's global collaborations driving innovation in consumables and equipment.
Indium Faces Complex Soldering Head On
04/17/2026 | Real Time with... APEX EXPOKevin Brennan of Indium Corporation discusses the complexities of soldering diverse component sizes on high-performance computing boards. He introduces DuraFuse LT solder paste, a novel solution designed to address challenges like uneven heating and warpage during reflow. This innovative alloy enables a wider operational window, reducing peak temperatures and enhancing product reliability without requiring board redesign.
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.