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SIA Applauds Finalization of CHIPS Investments for Intel Manufacturing Projects

11/29/2024 | SIA
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer praising finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and Intel Corporation.

Betamek Berhad Secures MYR 396,420 Government Grant for Digital Transformation

11/27/2024 | Betamek
Betamek Berhad has accepted a government grant of MYR 396,420 from the Ministry of Entrepreneur and Cooperatives Development, managed by Malaysia Industrial Development Finance Berhad.

SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects

11/21/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and GlobalFoundries.

SIA Commends Finalization of CHIPS Incentives for TSMC

11/18/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of the agreement to allocate incentives to TSMC under the CHIPS and Science Act. The agreement between TSMC and the U.S. Department of Commerce will support the expansion of TSMC’s semiconductor fabs in Arizona.

iNEMI HDI Socket Warpage Prediction and Characterization Webinar

11/15/2024 | iNEMI
High-density interconnect (HDI) sockets, primarily designed for CPUs and GPUs, are shifting toward larger form factors as the number of interconnect pins increases.
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