-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Northrop Grumman to Produce First Hypersonic Glide Phase Interceptor
September 30, 2024 | Northrop GrummanEstimated reading time: 1 minute
The U.S. Missile Defense Agency (MDA) will proceed with Northrop Grumman Corporation for the Glide Phase Interceptor (GPI) program, the first-of-its-kind defensive countermeasure against hypersonic missile threats. Working in close partnership with MDA, the three-year developmental effort produced a purpose-built, innovative design capable of defeating existing and emerging hypersonic threats.
During this next phase of development, Northrop Grumman will:
- Continue to refine the preliminary design of the GPI, which will fire from the U.S. Navy’s Aegis Ballistic Missile Defense destroyers and Aegis Ashore using the standard Vertical Launch System
- Demonstrate system performance in hypersonic environments prior to conducting its Preliminary Design Review
- Complete flight experiments ahead of schedule leveraging the company’s own flight-proven systems
- Use digital engineering practices to connect the entire GPI program to accelerate design processes and develop interceptor capabilities faster and more efficiently
Expert:
Wendy Williams, vice president and general manager, launch and missile defense systems, Northrop Grumman: “GPI adds mission critical standoff to warfighters in scenarios where distance creates an advantage. Tailorable to a multitude of mission requirements, Northrop Grumman’s revolutionary solution is designed to perform in the evolving threat landscape.”
Details:
Northrop Grumman’s design includes advanced technologies, such as a seeker for threat tracking and hit-to-kill accuracy, a re-ignitable upper stage engine used for threat containment and a dual engagement mode to engage threats across a wide range of altitudes.
Northrop Grumman will work closely with the United States in support of its role under the GPI Cooperative Development program with the Japan Ministry of Defense to deliver interceptors to the MDA.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
EMAC Returns with Bright Electronics Manufacturing Challenge 2026
04/30/2026 | SMTAThe Electronics Manufacturing & Assembly Collaborative (EMAC) has announced the return of the Bright Electronics Manufacturing Challenge 2026, an immersive, hands-on student competition that puts real electronics manufacturing experience into the hands of the next generation of engineers.
A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.
Zuken Launches GENESYS 2026 to Broaden Access and Improve MBSE Workflows
04/28/2026 | ZukenZuken announced GENESYS 2026, the latest version of its model-based systems engineering platform, with updates designed to improve performance, expand access to model-based information, and enhance the day-to-day modeling experience for engineering teams.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
Cadence Reports Q1 2026 Financial Results
04/28/2026 | Cadence Design SystemsCadence had a strong start to 2026, delivering a solid Q1 with accelerating AI demand and record backlog, reflecting strong customer commitment to our AI-driven portfolio,” said Anirudh Devgan, president and chief executive officer.