The Shaughnessy Report: Watt About Power Integrity?
Global PCB Connections: Understanding Your Fabricator’s Capabilities (or Niche)
Elementary Mr. Watson: Chasing Checkmarks, Not Signal Integrity
GEN3 Announces Strategic Partnership with Zestron to Enhance UK Electronics Manufacturing Reliability
October 1, 2024 | Gen3Estimated reading time: Less than a minute
GEN3, a leading British manufacturer of specialised test, measurement & production equipment for the electronics industry, has entered into a strategic partnership with Zestron, a renowned expert in electronic assembly quality and reliability.
This collaboration aims to elevate the standards of reliability and support for UK electronics manufacturing. GEN3 will offer a comprehensive range of Zestron’s products & analytical services alongside GEN3’s own test services to UK manufacturers, encompassing a full test and reliability service.
By combining Zestron's reliability, surfaces products and services with GEN3's deep understanding of UK electronics manufacturing, both companies aim to create a synergistic approach to addressing reliability challenges. This alliance aligns perfectly with both companies' core values.
Zestron's focus on reliability complements GEN3's Objective Evidence approach, which helps validate the reliability and robustness of electronic assemblies. UK electronics manufacturers will now have a single, comprehensive source for addressing reliability issues and finding solutions to complex challenges.
This strategic collaboration marks a significant step forward in enhancing the quality and reliability of UK-manufactured electronic assemblies, offering UK manufacturers a unified resource for tackling reliability issues and optimising their production processes.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
American Standard Circuits Achieves Successful AS9100 Recertification
10/14/2025 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading manufacturer of advanced printed circuit boards, proudly announces the successful completion of its AS9100 recertification audit. This milestone reaffirms ASC’s ongoing commitment to the highest levels of quality, reliability, and process control required to serve aerospace, defense, space, and other mission-critical industries.
SEL Showcases Global Factories and Product Development Journey for Manufacturing Day
10/10/2025 | SELSEL is celebrating Manufacturing Day 2025 with the release of a new video showcasing its product development and vertically integrated manufacturing process.
Dymax to Address Key Electronics Assembly Challenges with Light-Cure Solutions at SMTA International 2025
10/09/2025 | DymaxDymax, a global manufacturer of light-curing materials and equipment, will exhibit at SMTA International 2025 in Rosemont, Illinois, October 21–23. Visit booth 2834 to see how Dymax technologies protect components from harsh environments, help meet regulatory requirements, and streamline assembly.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.