It’s Only Common Sense: Selling to Today's Generation of Buyers
Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
GEN3 Announces Strategic Partnership with Zestron to Enhance UK Electronics Manufacturing Reliability
October 1, 2024 | Gen3Estimated reading time: Less than a minute
GEN3, a leading British manufacturer of specialised test, measurement & production equipment for the electronics industry, has entered into a strategic partnership with Zestron, a renowned expert in electronic assembly quality and reliability.
This collaboration aims to elevate the standards of reliability and support for UK electronics manufacturing. GEN3 will offer a comprehensive range of Zestron’s products & analytical services alongside GEN3’s own test services to UK manufacturers, encompassing a full test and reliability service.
By combining Zestron's reliability, surfaces products and services with GEN3's deep understanding of UK electronics manufacturing, both companies aim to create a synergistic approach to addressing reliability challenges. This alliance aligns perfectly with both companies' core values.
Zestron's focus on reliability complements GEN3's Objective Evidence approach, which helps validate the reliability and robustness of electronic assemblies. UK electronics manufacturers will now have a single, comprehensive source for addressing reliability issues and finding solutions to complex challenges.
This strategic collaboration marks a significant step forward in enhancing the quality and reliability of UK-manufactured electronic assemblies, offering UK manufacturers a unified resource for tackling reliability issues and optimising their production processes.
Share on:
Suggested Items
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
Marcy's Musings: The Hole Truth—Via Integrity in an HDI World
06/17/2025 | Marcy LaRont -- Column: Marcy's MusingsThis month, we’re talking about “the hole truth,” namely, via reliability in an HDI world. As I contemplated what it takes to get the “perfect” via, it got me thinking about what it takes to create the “perfect” magazine issue.
Advint Delivers Advanced Electroplating Training to Triangle Labs
06/02/2025 | Advint IncorporatedDuring the last week of April, Advint Incorporated conducted a comprehensive two-day on-site electroplating training session for the technical team at Triangle Labs, Inc., a key innovator in the printed circuit board space. The training was structured to align with the demands of high-reliability plating processes suitable for RF and high-frequency substrates.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.