-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
GEN3 Announces Strategic Partnership with Zestron to Enhance UK Electronics Manufacturing Reliability
October 1, 2024 | Gen3Estimated reading time: Less than a minute

GEN3, a leading British manufacturer of specialised test, measurement & production equipment for the electronics industry, has entered into a strategic partnership with Zestron, a renowned expert in electronic assembly quality and reliability.
This collaboration aims to elevate the standards of reliability and support for UK electronics manufacturing. GEN3 will offer a comprehensive range of Zestron’s products & analytical services alongside GEN3’s own test services to UK manufacturers, encompassing a full test and reliability service.
By combining Zestron's reliability, surfaces products and services with GEN3's deep understanding of UK electronics manufacturing, both companies aim to create a synergistic approach to addressing reliability challenges. This alliance aligns perfectly with both companies' core values.
Zestron's focus on reliability complements GEN3's Objective Evidence approach, which helps validate the reliability and robustness of electronic assemblies. UK electronics manufacturers will now have a single, comprehensive source for addressing reliability issues and finding solutions to complex challenges.
This strategic collaboration marks a significant step forward in enhancing the quality and reliability of UK-manufactured electronic assemblies, offering UK manufacturers a unified resource for tackling reliability issues and optimising their production processes.
Suggested Items
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.
The Knowledge Base: A Conference for Cleaning and Coating of Mission-critical Electronics
07/08/2025 | Mike Konrad -- Column: The Knowledge BaseIn electronics manufacturing, there’s a dangerous misconception that cleaning and coating are standalone options, that they operate in different lanes, and that one can compensate for the other. Let’s clear that up now. Cleaning and conformal coating are not separate decisions. They are two chapters in the same story—the story of reliability.
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
Marcy's Musings: The Hole Truth—Via Integrity in an HDI World
06/17/2025 | Marcy LaRont -- Column: Marcy's MusingsThis month, we’re talking about “the hole truth,” namely, via reliability in an HDI world. As I contemplated what it takes to get the “perfect” via, it got me thinking about what it takes to create the “perfect” magazine issue.