Global Citizenship: Chinese PCB Fabricators Will Remain an Important Part of the Supply Chain
Nolan’s Notes: The Interconnectedness of a Global Supply Chain
SMT Perspectives and Prospects: Warren Buffett’s Perpetual Wisdom, Part 1
GEN3 Announces Strategic Partnership with Zestron to Enhance UK Electronics Manufacturing Reliability
October 1, 2024 | Gen3Estimated reading time: Less than a minute
GEN3, a leading British manufacturer of specialised test, measurement & production equipment for the electronics industry, has entered into a strategic partnership with Zestron, a renowned expert in electronic assembly quality and reliability.
This collaboration aims to elevate the standards of reliability and support for UK electronics manufacturing. GEN3 will offer a comprehensive range of Zestron’s products & analytical services alongside GEN3’s own test services to UK manufacturers, encompassing a full test and reliability service.
By combining Zestron's reliability, surfaces products and services with GEN3's deep understanding of UK electronics manufacturing, both companies aim to create a synergistic approach to addressing reliability challenges. This alliance aligns perfectly with both companies' core values.
Zestron's focus on reliability complements GEN3's Objective Evidence approach, which helps validate the reliability and robustness of electronic assemblies. UK electronics manufacturers will now have a single, comprehensive source for addressing reliability issues and finding solutions to complex challenges.
This strategic collaboration marks a significant step forward in enhancing the quality and reliability of UK-manufactured electronic assemblies, offering UK manufacturers a unified resource for tackling reliability issues and optimising their production processes.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
ZESTRON to Exhibit at Upcoming SMTA Guadalajara Expo
08/07/2025 | ZESTRONZESTRON, a global leader in high-precision cleaning solutions and services, is excited to announce its participation in the 2025 SMTA Guadalajara Expo & Tech Forum.
Magnalytix’s Dr. Mike Bixenman to Guide PDC at SMTA High-Reliability Cleaning and Conformal Coating Conference
07/31/2025 | MAGNALYTIXMagnalytix, providing real-time reliability solutions for electronics manufacturing, is excited to announce that Dr. Mike Bixenman will present the professional development course “The Effects of Flux Residues and Process Contamination on the Reliability of the Electronic Assembly” on Wednesday, Aug. 13 at 9:00 AM CST to open the second day of the STMA High-Reliability Cleaning and Conformal Coating Conference.
Federal Electronics Mexico Enhances SMT Line with Installation of Heller Industries Reflow Oven
08/01/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has enhanced its surface mount technology (SMT) operations with the installation of a new Heller Industries reflow oven at its facility in Hermosillo. This upgrade supports the company’s continued growth in high-reliability markets such as aerospace, medical, industrial, and instrumentation.
KYZEN Cleaning Experts to Provide Insights at SMTA High Reliability Cleaning and Coating Conference
07/29/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, announced today that three members of the KYZEN team of cleaning experts will present technical presentations as part of KYZEN’s participation at the 2025 SMTA High Reliability Cleaning and Conformal Coating Conference scheduled to take place Aug. 12-14, 2025 at the Westin DFW Airport.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.