SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Standard of Excellence: Overcoming Service Failures—The Art of the Apology
Nolan’s Notes: Tariffs, Technologies, and Optimization
GEN3 Announces Strategic Partnership with Zestron to Enhance UK Electronics Manufacturing Reliability
October 1, 2024 | Gen3Estimated reading time: Less than a minute
GEN3, a leading British manufacturer of specialised test, measurement & production equipment for the electronics industry, has entered into a strategic partnership with Zestron, a renowned expert in electronic assembly quality and reliability.
This collaboration aims to elevate the standards of reliability and support for UK electronics manufacturing. GEN3 will offer a comprehensive range of Zestron’s products & analytical services alongside GEN3’s own test services to UK manufacturers, encompassing a full test and reliability service.
By combining Zestron's reliability, surfaces products and services with GEN3's deep understanding of UK electronics manufacturing, both companies aim to create a synergistic approach to addressing reliability challenges. This alliance aligns perfectly with both companies' core values.
Zestron's focus on reliability complements GEN3's Objective Evidence approach, which helps validate the reliability and robustness of electronic assemblies. UK electronics manufacturers will now have a single, comprehensive source for addressing reliability issues and finding solutions to complex challenges.
This strategic collaboration marks a significant step forward in enhancing the quality and reliability of UK-manufactured electronic assemblies, offering UK manufacturers a unified resource for tackling reliability issues and optimising their production processes.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
SEL Showcases Global Factories and Product Development Journey for Manufacturing Day
10/10/2025 | SELSEL is celebrating Manufacturing Day 2025 with the release of a new video showcasing its product development and vertically integrated manufacturing process.
Dymax to Address Key Electronics Assembly Challenges with Light-Cure Solutions at SMTA International 2025
10/09/2025 | DymaxDymax, a global manufacturer of light-curing materials and equipment, will exhibit at SMTA International 2025 in Rosemont, Illinois, October 21–23. Visit booth 2834 to see how Dymax technologies protect components from harsh environments, help meet regulatory requirements, and streamline assembly.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.