The Shaughnessy Report: Breaking Down the Language Barrier
Connect the Dots: Designing for Reality—Routing, Final Fab, and QC
Target Condition: ‘Boomer to Zoomer: Do You Copy?’
AIM to Present on Ultra-Miniature Component Assembly at SMT-Info
October 2, 2024 | AIMEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMT-Info Technical Conference taking place October 15-16 in Brno, Czech Republic. AIM’s Ales Sedlak will be giving a presentation titled “Addressing Concerns of Ultra-Miniature Component Assembly: M0201, 008005, and Micro/MiniLEDs.”
Presentation abstract: The use of ultra-miniature components is driven by the demand for increased functionality in electronic devices. SMT components such as 008004/M0201 are being used in consumer and automotive applications today. Similarly, MiniLED components are finding their way into displays available in the market. Manufacturers are creating new PCB designs, using novel assembly techniques, and introducing innovative materials to overcome the unique challenges faced when implementing these components. This presentation will discuss the new information on how to overcome the challenges faced in ultra-miniature component assembly and address the needs of emerging markets.
Among other great products, AIM will also be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste at this event. AIM’s NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at SMT-Info October 15-16.
Share on:
Suggested Items
Statement from IPC, the Global Electronics Association, on Recent U.S. Tariffs and Global Trade
03/07/2025 | IPCIPC shared the following statement today on U.S. tariffs and their implications on the global electronics industry. This statement can be attributed to Dr. John W. Mitchell, IPC president and CEO:
CELUS Drops BOM on Electronics Design Complexity
03/05/2025 | BUSINESS WIRECELUS, developer of the leading AI-assisted electronics design platform used by developers and engineers globally, unveiled a new bill of materials (BOM) experience that better satisfies the needs of electronic engineers by helping them choose the right components for the early stages of their PCB design.
2025 IEEE Electronic Components and Technology Conference
03/04/2025 | IEEEMore than 2,000 scientists, engineers and businesspeople are expected to attend the 75th annual IEEE Electronic Components and Technology Conference (ECTC) from May 27-30, 2025 at the Gaylord Texan Resort & Convention Center here.
ASMPT at IPC APEX EXPO 2025
03/04/2025 | ASMPTASMPT, the leading provider of hardware and software for semiconductor and electronics manufacturing, will again demonstrate its technology leadership in component flexibility and software solutions at this year’s IPC APEX EXPO being held March 18-20 in Anaheim, California.
Incap’s Estonian Factory Invests in Innovative X-ray Technology
03/04/2025 | IncapThe electronics manufacturing company Incap Estonia, based in Saaremaa, has enhanced its quality control capabilities with a new high-resolution X-ray system.