Flexible Thinking: Integrated Passive Devices—Design Solutions With Many Benefits
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBsGlobal Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024
October 2, 2024 | SEMIEstimated reading time: 1 minute
Powered by strong semiconductor demand across diverse end applications, the global semiconductor packaging materials market is expected to start a growth cycle with a 5.6% compound annual growth rate (CAGR) projected through 2028, SEMI, TECHCET and TechSearch International announced in their latest Global Semiconductor Packaging Materials Outlook (GSPMO) report. The report highlights AI as an expected growth driver for advanced packaging applications, despite currently low unit volumes due to the newness of the market segment.
The GSPMO report provides comprehensive data and forecasts for substrates, leadframes, bonding wire, and additional advanced packaging materials.
“After a challenging 2023, which saw a 15.5% decline in the semiconductor packaging materials market, our latest report forecasts a return to growth in 2024,” said Lita Shon-Roy, TECHCET President and CEO. “The global packaging materials market is expected to exceed $26 billion by 2025 and continue solid growth through 2028.”
Global packaging materials
“Substrates account for a large portion of the revenue for the packaging materials market, and within the category, FC-BGA substrates make up the majority of the revenue growth,” said Jan Vardaman, President of TechSearch International. “The CAGR for flip chip BGA/LGA revenue is expected to be 7.6% from 2023 to 2028. Other key growth areas include wafer-level packaging (WLP) dielectrics and flip chip underfill. The laminate substrates segment is expected to grow 7.3% annually in volume, while leadframes and bonding wire are also forecasted to recover, growing by 5.0% and 6.4%, respectively.”
The GSPMO 2024 report is designed to help companies capitalize on emerging trends, navigate supply chain challenges, and make informed decisions in sourcing high-performance materials.
Share on:
Suggested Items
TAZMO, TAIFLEX Ink MoU on Taiwan-Japan Semiconductor Cooperation
10/04/2024 | TAIFLEX Scientific Co. LtdTazmo Co., Ltd. and TAIFLEX Co., Ltd. held a public signing ceremony and press conference for the “Memorandum of Understanding on Taiwan-Japan Semiconductor Cooperation” in Taipei.
Camtek Introduced 5th Generation of the Eagle System Supporting Expected Growth In 2025
09/30/2024 | CamtekCamtek Ltd. is pleased to announce the launch of the latest leading inspection system, the Eagle Generation-5 (Eagle G5), marking a significant advancement in Camtek’s inspection and metrology technological capabilities.
Cross-domain Design: The Key to Managing Complex Methodologies
09/23/2024 | Andy Shaughnessy, Design007 MagazineFor years, Cadence Design Systems has been developing EDA tools that enable the design of ICs and PCBs. Now, as systems continually become more complex, the lines are blurring between these disciplines, and EDA companies are providing designers of PCBs and ICs the ability to understand what’s happening upstream and downstream. We asked John Park, product management group director for advanced IC packaging at Cadence, to discuss this ongoing convergence of domains, as well as what it all means to designers and design engineers.
AI to Boost Wafer Foundry Market by 20%
09/19/2024 | TrendForceTrendForce posits that the wafer foundry market is expected to see a recovery in 2025, with an estimated annual growth of 20%—up from 16% in 2024.
Elementary, Mr. Watson: The Paradigm Shift of Silicon-to-System Design
09/18/2024 | John Watson -- Column: Elementary, Mr. WatsonImagine you were asked to build a city. What approach would you take? In the old way, city planners designed each building independently. They focused on making each building strong, aesthetically pleasing, and valuable. But they didn't always consider how all the buildings would fit together in the city. Roads, power lines, and parks were added later, sometimes making the city confusing or complicated to get around.