Beyond Design: High-speed Rules of Thumb
Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards
The Shaughnessy Report: A Handy Look at Rules of Thumb
Department of Defense Awards $30 Million to Expand Domestic Printed Circuit Board and Substrate Production
October 1, 2024 | Department of DefenseEstimated reading time: 1 minute
The Department of Defense announced today a $30 million award to TTM Technologies Inc. (TTM) in Santa Ana, California. This award, facilitated through the Defense Production Act Purchases (DPAP) office, will enable TTM to acquire and install advanced manufacturing equipment and develop prototype designs for printed circuit boards. The project will commence at TTM's Centers of Excellence across the United States, ultimately culminating in integration into its new Syracuse, New York facility. This strategic initiative aims to enhance TTM's capabilities and enable the timely delivery of cutting-edge technology to support vital defense programs.
"The DoD requires state-of-the-art advanced printed circuit board manufacturing capability to support defense programs," said Dr. Laura Taylor-Kale, Assistant Secretary of Defense for Industrial Base Policy (ASD(IBP)). "This project provides domestic manufacturing capabilities to meet demand for current and future U.S. systems."
"This $30 million investment will help enable TTM to build a new 200,000+ square foot facility, significantly increasing domestic production of ultra-high density printed circuit boards and bolstering supply chain resilience in line with the 2024 National Defense Industrial Strategy," added Mr. Anthony Di Stasio, Director of the Manufacturing Capability Expansion and Investment Prioritization (MCEIP) directorate within OASD(IBP).
This was the 70th award the DPAP program issued across multiple areas in Fiscal Year 2024, for a total value of $672 million. The DPAP office is overseen by the MCEIP directorate.
Share on:
Suggested Items
Romania Becomes the 20th Member of the F-35 Global Alliance
11/21/2024 | Lockheed MartinThe Government of Romania confirmed today its intent to procure 32 Lockheed Martin 5th Generation F-35 Lightning II aircraft by signing a Letter of Offer and Acceptance (LOA) through a U.S. government Foreign Military Sale.
Spirit Announces Purchase Agreement with Tex Tech Industries for Intended Sale of FMI
11/19/2024 | Spirit AeroSystems, Inc.Spirit AeroSystems Holdings, Inc. announces a purchase agreement to sell Fiber Materials, Inc (FMI) business based in Biddeford, Maine, and Woonsocket, Rhode Island, to Tex-Tech Industries, Inc. for $165,000,000 in cash, subject to customary adjustment.
AirBorn Announces Agreement to be Acquired by Molex
11/18/2024 | PRNewswireAirBorn, a global manufacturer of high reliability electronics and components, announced it has entered into an agreement to be acquired by Molex, a leading global connectivity and electronics solutions provider.
ZenaTech Participates in Taiwan Trade Mission to Open First Asian Office for ZenaDrone AI Drone Sensor and Component Manufacturing
11/07/2024 | NEWMEDIAWIREZenaTech, Inc., a technology company specializing in AI (Artificial Intelligence) drone solutions and enterprise SaaS (Software-as-a-Service) solutions, announces that company principals are currently participating in a Trade Mission to Taipei, Taiwan as part of an Arizona Commerce Authority (ACA) delegation, with the goal of opening a manufacturing office for its previously announced Spider Vision Sensors Ltd. subsidiary.
MACOM Expands IC Design Expertise with Acquisition of ENGIN-IC
11/06/2024 | BUSINESS WIREMACOM Technology Solutions Holdings, Inc., a leading supplier of semiconductor products, announced today that it has acquired ENGIN-IC, Inc., a fabless semiconductor company that designs advanced Gallium Nitride (GaN) monolithic microwave integrated circuits (MMICs) and integrated microwave assemblies located in Plano, Texas and San Diego, California.