Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage
Elementary, Mr. Watson: Why Your PCB Looks Like a Studio Apartment
The Shaughnessy Report: A Plan for Floor Planning
American Standard Circuits' John Johnson to Speak at Ultra HDI Symposium
January 6, 2025 | American Standard CircuitsEstimated reading time: 2 minutes
Anaya Vardya, president and CEO of American Standard Circuits, announced that his company’s Director of Quality/Advanced Technology, John Johnson, will be speaking at this year’s Ultra HDI Symposium, Jan. 23, in Peoria, Arizona.
Johnson’s talk, "It Depends: Ultra HDI Fabrication Methods and Trade-Off's," will cover the fabrication methods for ultra HDI printed circuit boards and design considerations for various options. American Standard Circuits is one of the industry’s leaders when it comes to the engineering and fabrication of ultra HDI PCBs and Johnson is an expert on the topic.
As a long-time industry innovator, Johnson has a great deal of experience in the engineering, quality management and fabrication of PCBs. He is currently leading ASC's charge into the technological future of printed circuit boards
Mr. Johnson will also participate in the panel discussion, "Bridging the Gap: Accelerating Ultra HDI Adoption through Collaboration," alongside other industry leaders including:
- Chrys Shea, Shea Engineering
- Gayle Towell, AIM Solder
- Gerry Partida, Summit Interconnect
- Paul Cooke, AGC Multi Material America
- Stephen Chavez, Siemens
The event will also spotlight:
- Lab-to-Fab Updates: Key insights and forward-looking action items stemming from SMTAi 2024 Ultra HDI Learning Pavilion discussions.
- Miniaturization in Assembly: Solutions to the growing challenges shrinking feature sizes.
- PCB Fabrication Breakthroughs: New materials, processes, and equipment transforming Ultra HDI.
- DFM & Signal Integrity: Strategies for optimizing design with ultra-thin PCB materials and ensuring signal integrity, with a focus on DFM’s role for both fabrication and assembly.
- Future Technologies: A look at emerging innovations LCP with 10-micron embedded traces and sub-5-micron features on next-generation materials.
Industry leaders will come together to exchange ideas and drive the future of Ultra HDI. It’s a do not miss opportunity to stay ahead in a rapidly evolving field.
Check out these educational offerings from American Standard Circuits | ASC Sunstone:
- The Printed Circuit Designer's Guide to... DFM Essentials
- The Printed Circuit Designer’s Guide to... Fundamentals of RF/Microwave PCBs
- The Printed Circuit Designer’s Guide to... Flex and Rigid-Flex Fundamentals
- The Companion Guide to Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator's Perspective
- On the Line with...ASC Sunstone: Design for Manufacturing Podcast
Visit I-007eBooks.com to download these and other free titles.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
UHDI Fundamentals: UHDI Technology and Industry 4.0
08/05/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. This article explores the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
TT Electronics Secures Multi-Million-Pound Defense Contract with Ultra PCS
07/18/2025 | TT ElectronicsTT Electronics, a leading provider of global manufacturing solutions and engineered technologies, announced that it has been awarded a significant new contract with long-standing customer Ultra PCS Ltd (Ultra Precision Control Systems).
TRI Unveils New Platform for Diverse Board Sizes
07/14/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces a new size configuration for SPI and AOI Models.
The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
American Standard Circuits to Exhibit at IMS 2025
06/12/2025 | American Standard CircuitsAnaya Vardya, President and CEO of American Standard Circuits & ASC Sunstone Circuits, announced that his companies will exhibit at the IEEE International Microwave Symposium (IMS 2025), taking place June 15-20, 2025, at San Francisco’s Moscone Center.