Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Connect the Dots: How to Avoid Five Common Causes of Board Failure
American Standard Circuits' John Johnson to Speak at Ultra HDI Symposium
January 6, 2025 | American Standard CircuitsEstimated reading time: 2 minutes
Anaya Vardya, president and CEO of American Standard Circuits, announced that his company’s Director of Quality/Advanced Technology, John Johnson, will be speaking at this year’s Ultra HDI Symposium, Jan. 23, in Peoria, Arizona.
Johnson’s talk, "It Depends: Ultra HDI Fabrication Methods and Trade-Off's," will cover the fabrication methods for ultra HDI printed circuit boards and design considerations for various options. American Standard Circuits is one of the industry’s leaders when it comes to the engineering and fabrication of ultra HDI PCBs and Johnson is an expert on the topic.
As a long-time industry innovator, Johnson has a great deal of experience in the engineering, quality management and fabrication of PCBs. He is currently leading ASC's charge into the technological future of printed circuit boards
Mr. Johnson will also participate in the panel discussion, "Bridging the Gap: Accelerating Ultra HDI Adoption through Collaboration," alongside other industry leaders including:
- Chrys Shea, Shea Engineering
- Gayle Towell, AIM Solder
- Gerry Partida, Summit Interconnect
- Paul Cooke, AGC Multi Material America
- Stephen Chavez, Siemens
The event will also spotlight:
- Lab-to-Fab Updates: Key insights and forward-looking action items stemming from SMTAi 2024 Ultra HDI Learning Pavilion discussions.
- Miniaturization in Assembly: Solutions to the growing challenges shrinking feature sizes.
- PCB Fabrication Breakthroughs: New materials, processes, and equipment transforming Ultra HDI.
- DFM & Signal Integrity: Strategies for optimizing design with ultra-thin PCB materials and ensuring signal integrity, with a focus on DFM’s role for both fabrication and assembly.
- Future Technologies: A look at emerging innovations LCP with 10-micron embedded traces and sub-5-micron features on next-generation materials.
Industry leaders will come together to exchange ideas and drive the future of Ultra HDI. It’s a do not miss opportunity to stay ahead in a rapidly evolving field.
Check out these educational offerings from American Standard Circuits | ASC Sunstone:
- The Printed Circuit Designer's Guide to... DFM Essentials
- The Printed Circuit Designer’s Guide to... Fundamentals of RF/Microwave PCBs
- The Printed Circuit Designer’s Guide to... Flex and Rigid-Flex Fundamentals
- The Companion Guide to Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator's Perspective
- On the Line with...ASC Sunstone: Design for Manufacturing Podcast
Visit I-007eBooks.com to download these and other free titles.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
UHDI Fundamentals: UHDI Technology and Industry 4.0
08/05/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. This article explores the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.