Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Introducing the Ultra HDI Learning Pavilion at SMTA International 2024
October 7, 2024 | SMTAEstimated reading time: 2 minutes
The SMTA is thrilled to announce the launch of the Ultra HDI (UHDI) Learning Pavilion, a first-of-its-kind experience dedicated to advancing Ultra-High Density Interconnect technology. Taking place in booth #2753 during SMTA International, October 22-24, 2024 in Rosemont, Illinois, this interactive and educational pavilion is FREE and open to all attendees.
The UHDI Pavilion will serve as the hub for industry professionals eager to dive into the world of UHDI, where groundbreaking advancements in miniaturization are pushing the boundaries of electronics manufacturing. Attendees can explore a packed schedule of technical sessions led by experts from across the supply chain, focusing on UHDI Test Board design, fabrication materials, assembly processes, and solutions to address the ongoing challenges of miniaturization.
Key Highlights of the UHDI Pavilion:
Technical Sessions:
A diverse range of sessions will cover essential topics such as UHDI Test Board Design, Ultra HDI Demand, Fabrication, Materials, Ultra-Fine Solder Powders, Stencil, Inspection and Component Placement. Industry experts will share their insights and innovations.
"Lab to Fab" Working Session:
On Wednesday, October 23 from 3:00 to 4:00 PM, join Elliott Fowler of Sandia National Laboratories, Bill Capen, Honeywell FM&T and Chrys Shea for the "Lab to Fab" working session. This session is designed to break down silos and foster collaboration across the supply chain, accelerating the transition from concept to production.
Networking Opportunities:
The UHDI Pavilion will also feature dedicated networking time on Thursday, October 24, allowing attendees to connect with key players in the UHDI space and explore potential partnerships.
Ultra HDI Pavilion Schedule Highlights:
Wednesday, October 23
- 10:00-10:20: Chrys Shea, Shea Engineering, "UHDI Test Board Design and Reasoning"
- 10:30-11:15: Guest Speaker, "Demand and Why We Need UHDI"
- 11:30-11:50: Paul Cooke, AGC, "Fabrication Materials for UHDI"
- 12:00-12:20: John Johnson, ASC, "Fabrication Processes for UHDI"
- 12:30-12:50: Greg Smith, Blue Ring, "Stencil"
- 1:00-1:20: Gayle Towell, AIM Solder, "Materials (Ultra Fine Powders)"
- 1:30-1:50: Brent Fischthal, Koh Young America, "Inspection"
- 2:00-2:20: Guest Speaker, "Component Placement"
- 2:30-2:50: Bill Capen, Honeywell FM&T, "Cleaning and SIR"
- 3:00-4:00: Elliott Fowler, Sandia National Laboratories, Bill Capen, Honeywell FM&T and Chrys Shea, Shea Engineering, "Lab to Fab - Working Session"
Thursday, October 24
- 10:00-10:30: Paul Cooke, AGC, "Additive Fabrication Options: What’s the Big Deal?"
- 11:00-11:30: John Johnson, ASC, "It Depends: PCB Design Trade-Offs"
- 11:30-1:00: Networking Session
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Interposers, Substrates, and Advanced Manufacturing
10/13/2025 | Marcy LaRont, I-Connect007I attend a lot of industry trade shows and conferences. Lately, during conversations with technologists, I’ve noticed that there is some confusion about what exactly constitutes an interposer. One question I hear every so often is, “Are all interposers substrates?” The short answer to that question is no. But some interposers are, in fact, full substrates.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
New Podcast Episode: How Does UHDI Benefit SWaP?
10/03/2025 | I-Connect007In podcast episode 4, “SWaP Considerations,” host Nolan Johnson welcomes back industry expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI delivers measurable advantages in size, weight, and power (SWaP)—unlocking new possibilities in speed, efficiency, and miniaturization.