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Introducing the Ultra HDI Learning Pavilion at SMTA International 2024
October 7, 2024 | SMTAEstimated reading time: 2 minutes
The SMTA is thrilled to announce the launch of the Ultra HDI (UHDI) Learning Pavilion, a first-of-its-kind experience dedicated to advancing Ultra-High Density Interconnect technology. Taking place in booth #2753 during SMTA International, October 22-24, 2024 in Rosemont, Illinois, this interactive and educational pavilion is FREE and open to all attendees.
The UHDI Pavilion will serve as the hub for industry professionals eager to dive into the world of UHDI, where groundbreaking advancements in miniaturization are pushing the boundaries of electronics manufacturing. Attendees can explore a packed schedule of technical sessions led by experts from across the supply chain, focusing on UHDI Test Board design, fabrication materials, assembly processes, and solutions to address the ongoing challenges of miniaturization.
Key Highlights of the UHDI Pavilion:
Technical Sessions:
A diverse range of sessions will cover essential topics such as UHDI Test Board Design, Ultra HDI Demand, Fabrication, Materials, Ultra-Fine Solder Powders, Stencil, Inspection and Component Placement. Industry experts will share their insights and innovations.
"Lab to Fab" Working Session:
On Wednesday, October 23 from 3:00 to 4:00 PM, join Elliott Fowler of Sandia National Laboratories, Bill Capen, Honeywell FM&T and Chrys Shea for the "Lab to Fab" working session. This session is designed to break down silos and foster collaboration across the supply chain, accelerating the transition from concept to production.
Networking Opportunities:
The UHDI Pavilion will also feature dedicated networking time on Thursday, October 24, allowing attendees to connect with key players in the UHDI space and explore potential partnerships.
Ultra HDI Pavilion Schedule Highlights:
Wednesday, October 23
- 10:00-10:20: Chrys Shea, Shea Engineering, "UHDI Test Board Design and Reasoning"
- 10:30-11:15: Guest Speaker, "Demand and Why We Need UHDI"
- 11:30-11:50: Paul Cooke, AGC, "Fabrication Materials for UHDI"
- 12:00-12:20: John Johnson, ASC, "Fabrication Processes for UHDI"
- 12:30-12:50: Greg Smith, Blue Ring, "Stencil"
- 1:00-1:20: Gayle Towell, AIM Solder, "Materials (Ultra Fine Powders)"
- 1:30-1:50: Brent Fischthal, Koh Young America, "Inspection"
- 2:00-2:20: Guest Speaker, "Component Placement"
- 2:30-2:50: Bill Capen, Honeywell FM&T, "Cleaning and SIR"
- 3:00-4:00: Elliott Fowler, Sandia National Laboratories, Bill Capen, Honeywell FM&T and Chrys Shea, Shea Engineering, "Lab to Fab - Working Session"
Thursday, October 24
- 10:00-10:30: Paul Cooke, AGC, "Additive Fabrication Options: What’s the Big Deal?"
- 11:00-11:30: John Johnson, ASC, "It Depends: PCB Design Trade-Offs"
- 11:30-1:00: Networking Session
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