Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Happy’s Tech Talk #35: Yields March to Design Rules

12/12/2024 | Happy Holden -- Column: Happy’s Tech Talk
Ultra high density interconnect (UHDI) has many forms, structures, and alternatives, so capturing all the variations and reducing them to design rules has required some departures from traditional IPC design standards. In this column, I’ll be discussing the IPC UHDI design guidelines and standards. The fundamental question is: “Do you need HDI or microvias?”

The Shaughnessy Report: A Stack of Advanced Packaging Info

12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy Report
It’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.

Real Time with... electronica 2024: NCAB—Shaping the Future of Electronics Manufacturing

12/05/2024 | Real Time with... electronica
Michael Larsson, Global Director of Sales at NCAB, shares insights into the company's focus on sourcing production outside of China as well as their commitment to sustainability through innovative materials for recyclable PCBs.

UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 1

11/14/2024 | Anaya Vardya, American Standard Circuits
Last month, I talked about ultra high definition interconnect (UHDI) in relation to entertainment applications. This month, I will explain bleeding-edge UHDI applications in manufacturing, which are revolutionizing the industry by enabling ultra-precise visual data transmission, high-speed communication between devices, and real-time monitoring. These UHDI technologies help manufacturers achieve higher efficiency, better quality control, and greater automation. Following are some leading-edge manufacturing applications of UHDI in manufacturing.

One Partial HDI Technique: mSAP 

11/05/2024 | Andy Shaughnessy, Design007 Magazine
Chris Hunrath, vice president of technology at Insulectro, believes that mSAP just might be the trick for designers considering partial HDI. As Chris explains, the materials and equipment required for the mSAP process are easily available, and the process is well established. This could be a great option for designers working with BGAs that have a pitch of 0.5 mm or less.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in