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Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

Design007’s Top 10 Reader’s Picks for 2025

01/08/2026 | Nolan Johnson, I-Connect007
The design dynamic duo, Design007 Magazine and the Design007 Week newsletter, covered a wide range of topics in 2025. Here are the top 10 design-related articles, columns and news reports for the year. This list, comprised of two columns, three articles, and five news items, relies entirely on readership numbers, making for as fair a comparison as possible. 

UHDI Fundamentals: An Overview of UHDI Layer Types

01/02/2026 | Anaya Vardya, American Standard Circuits
UHDI layer types include core, sequential lamination build-up; microvia; embedded and passive antennas and inductors; and embedded functional, protective, and hybrid rigid-flex layers. Together, they enable ultra-fine features, dense interconnects, high-frequency performance, and miniaturized system designs. UHDI typically requires multiple SBU cycles, where thin dielectric and copper layers are drilled for microvias, plated, imaged, and laminated sequentially to build up to the final design from the inside out.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

12/19/2025 | Nolan Johnson, I-Connect007
We are days away from the end of 2025 and the beginning of 2026. This Jan. 1 will mark not only the end of a year, but also the end of a quarter-century. Doors are closing, while others are opening, and it wasn’t until I collated my must-reads this week that I noticed that a similar theme, though perhaps with more grace than in other current events around the globe. First up is the final episode of John Johnson’s series on UHDI. If you’re the type of person who reads the last chapter of a book first, definitely start with this episode, then listen to the rest of the series.

Final Episode of I-Connect007’s UHDI Podcast Series Now Available On Demand

12/17/2025 | I-Connect007
I-Connect007 announces the release of the final episode of its podcast series, On the Line With… American Standard Circuits: UHDI. Episode 12, titled “UHDI? It Depends,” brings the series to a close with an engaging, FAQ-driven discussion addressing the PCB industry’s most common questions about ultra-high-density interconnect (UHDI) technology.

Fresh PCB Concepts: Choosing Via Types—A Practical Guide for PCB Engineers 

12/18/2025 | Team NCAB -- Column: Fresh PCB Concepts
When you first learn PCB routing, vias look like plumbing: holes that let signals pass between layers. As designs become denser and products shrink, vias develop from simple interconnects into deliberate engineering choices. Selecting between through-hole, blind, buried, microvia, or advanced options like skip vias is a balancing act between electrical performance, manufacturability, cost, and long-term reliability. In HDI boards, via strategy is as consequential as the stackup, material selection, or component placement. 
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