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The Shaughnessy Report: Are You Partial to Partial HDI?

10/08/2024 | Andy Shaughnessy -- Column: The Shaughnessy Report
Sometimes, a little technology is all you need. Star Trek’s Borg character only needs a funky eyepiece contraption to access all The Collective’s data, like an outer space Wi-Fi. Like the Borg’s eyepiece, we may only need a little bit of HDI in one corner of the board. We might only need partial HDI.

Introducing the Ultra HDI Learning Pavilion at SMTA International 2024

10/07/2024 | SMTA
The SMTA is thrilled to announce the launch of the Ultra HDI (UHDI) Learning Pavilion, a first-of-its-kind experience dedicated to advancing Ultra-High Density Interconnect technology.

Cost-optimize Your PCB Design and Specifications

08/20/2024 | Erik Pedersen and Richard Koensgen, ICAPE Group
Knowledge is the key to identifying the small details that makes the big cost difference for your printed circuit board. There are many types of printed circuit boards and multiple choices between the development of schematic and BOM to PCB technology selection, electronic PCB design, mechanical and physical properties, and PCB specification.

UHDI Fundamentals: UHDI Applications for Aerospace

08/13/2024 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology refers to advanced manufacturing processes used to create extremely compact and highly efficient electronic circuits at the sub-1-mil line and space level. In aerospace applications, UHDI is crucial due to the stringent requirements for weight, reliability, and performance in a challenging environment.

Happy’s Tech Talk #31: Novel Ultra HDI Architectures

08/12/2024 | Happy Holden -- Column: Happy’s Tech Talk
Ultra HDI has become the focus for many fabricators, especially as the follow-on for the 40-year-old conventional HDI. But there is more to UHDI than just finer traces and spaces. Novel architectures have been developed that complement the new dense lithography. One of the major advantages of HDI, and especially ultra HDI, is the miniature features of the process. Since the microvias and lands are so small, they can be swung around at various angles between the BGA lands. The angles and distances will depend on the BGA pitch and where the microvia is placed relative to the BGA SMT land.
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