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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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October Issue of Design007 Magazine: Partial HDI
October 8, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Partial HDI refers to the targeted use of HDI, usually on one section of one layer of the board. It offers designers an avenue for escape routing from BGAs with a pitch of .5 mm or less, when a mechanically drilled plated through-hole is impossible. With HDI relegated to one layer of the board, fabricators can avoid the expense of sequential lamination cycles.
In the October issue of Design007 Magazine, our expert contributors provide a complete, detailed view of partial HDI. Most experienced PCB designers can start using this approach right away. But you need to know these tips, tricks and techniques first.
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Brent Fischthal - Koh YoungSuggested Items
SMTA Ultra HDI Symposium, Day 2: Fragile Supply Chains, Fierce Innovation
04/14/2026 | Marcy LaRont, I-Connect007The Arizona weather yielded another beautiful day as we gathered for the second day of SMTA’s annual UHDI symposium. After the first full day discussing the role of AI in business and the how-tos of implementation, Avondale Mayor Mike Pineda kicked off day two, proud to showcase his city and to declare its important place in the continued development of the West Valley, an increasingly important area for tech and manufacturing.
SMTA Ultra HDI Symposium, Day 1: AI at the Core or Out of the Game
04/13/2026 | Marcy LaRont, I-Connect007It was a beautiful 81°F morning in Arizona last Wednesday as I headed to the third annual SMTA Ultra HDI Symposium, focused on AI and ultra high density interconnect technology. Strategically held as part of Arizona’s Tech Week, this year’s conference took place in Avondale in Phoenix's West Valley. The event moved from the cozy offices of the Peoria Sports Complex (which paid homage to baseball’s spring training world) to the larger Avondale Conference Center, highlighting the importance of this area for electronics manufacturing investment.
AdvancedPCB Strengthens HDI Process Control with New AOI Investment in Chandler, AZ Facility
03/23/2026 | AdvancedPCBAdvancedPCB has expanded its high-density interconnect (HDI) quality inspection capabilities with the installation of the CIMS Phoenix MDI AOI system in its Chandler, Arizona facility, enabling precision inspection of mechanical drills down to 150 µm in diameter.
SMTA Announces Program for 2026 Ultra High Density Interconnect (UHDI) Symposium
03/20/2026 | SMTAThe SMTA is excited to announce the technical program for the 3rd annual Ultra High Density Interconnect Symposium which takes place on April 9, 2026 in Avondale, Arizona, USA.
Sustainability Takes Center Stage in ‘On the Line With… Isola’ Podcast, Episode 3
03/25/2026 | I-Connect007I-Connect007 announces the release of Episode 3 of the podcast series On the Line With…, titled “The Green Circuit—Sustainability in PCB Manufacturing.” In this installment of PCB Materials: The Backbone and Future of Electronics, host Marcy LaRont speaks with Isola CTO Kirk Thompson about the growing role sustainability is playing in shaping the next generation of PCB materials and manufacturing processes.