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From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
Designing Proper Work-Life Balance
In this issue, we hear from designers, marketers, and business owners on how they apply their professional skills to their personal lives to build a healthier work-life balance.
Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
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October Issue of Design007 Magazine: Partial HDI
October 8, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Partial HDI refers to the targeted use of HDI, usually on one section of one layer of the board. It offers designers an avenue for escape routing from BGAs with a pitch of .5 mm or less, when a mechanically drilled plated through-hole is impossible. With HDI relegated to one layer of the board, fabricators can avoid the expense of sequential lamination cycles.
In the October issue of Design007 Magazine, our expert contributors provide a complete, detailed view of partial HDI. Most experienced PCB designers can start using this approach right away. But you need to know these tips, tricks and techniques first.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Design007’s Top 10 Reader’s Picks for 2025
01/08/2026 | Nolan Johnson, I-Connect007The design dynamic duo, Design007 Magazine and the Design007 Week newsletter, covered a wide range of topics in 2025. Here are the top 10 design-related articles, columns and news reports for the year. This list, comprised of two columns, three articles, and five news items, relies entirely on readership numbers, making for as fair a comparison as possible.
UHDI Fundamentals: An Overview of UHDI Layer Types
01/02/2026 | Anaya Vardya, American Standard CircuitsUHDI layer types include core, sequential lamination build-up; microvia; embedded and passive antennas and inductors; and embedded functional, protective, and hybrid rigid-flex layers. Together, they enable ultra-fine features, dense interconnects, high-frequency performance, and miniaturized system designs. UHDI typically requires multiple SBU cycles, where thin dielectric and copper layers are drilled for microvias, plated, imaged, and laminated sequentially to build up to the final design from the inside out.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/19/2025 | Nolan Johnson, I-Connect007We are days away from the end of 2025 and the beginning of 2026. This Jan. 1 will mark not only the end of a year, but also the end of a quarter-century. Doors are closing, while others are opening, and it wasn’t until I collated my must-reads this week that I noticed that a similar theme, though perhaps with more grace than in other current events around the globe. First up is the final episode of John Johnson’s series on UHDI. If you’re the type of person who reads the last chapter of a book first, definitely start with this episode, then listen to the rest of the series.
Final Episode of I-Connect007’s UHDI Podcast Series Now Available On Demand
12/17/2025 | I-Connect007I-Connect007 announces the release of the final episode of its podcast series, On the Line With… American Standard Circuits: UHDI. Episode 12, titled “UHDI? It Depends,” brings the series to a close with an engaging, FAQ-driven discussion addressing the PCB industry’s most common questions about ultra-high-density interconnect (UHDI) technology.
Fresh PCB Concepts: Choosing Via Types—A Practical Guide for PCB Engineers
12/18/2025 | Team NCAB -- Column: Fresh PCB ConceptsWhen you first learn PCB routing, vias look like plumbing: holes that let signals pass between layers. As designs become denser and products shrink, vias develop from simple interconnects into deliberate engineering choices. Selecting between through-hole, blind, buried, microvia, or advanced options like skip vias is a balancing act between electrical performance, manufacturability, cost, and long-term reliability. In HDI boards, via strategy is as consequential as the stackup, material selection, or component placement.