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TopLine to Exhibit 'Drop-in Replacement' for BGA at Electronica
October 16, 2024 | TopLineEstimated reading time: Less than a minute

TopLine Corporation will exhibit its latest technology solutions at Electronica in Munich, Germany, November 12 – 15, 2024, in stand B4.428. The exhibit will include leading TopLine products including CCGA, Superconducting Solder Column, Bonding wire, IC Chip Tray, Zero-Ohm Jumper and more. TopLine manufactures a wide range of solder columns for CCGA semiconductor packages, and provides Daisy Chain CCGA packages for engineering development, profiling, and practice.
TopLine recently announced the availability of Braided Solder Columns as drop-in replacements for BGA balls for Quantum Computers and next generation applications including Very Large 2.5D Packages. For more information, visit Booth B4.428 at Electronica.
Electronica is the world's leading trade fair and conference for electronics, produced every 2 years since 1964 by Messe München.
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See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
TopLine Bringing Answers, New Ideas to APEX 2025
02/04/2025 | TopLineTopLine® Corporation’s engineers will discuss groundbreaking technologies and product solutions at the upcoming IPC APEX EXPO 2025 this coming March 18-20 at the Anaheim Convention Center in California.
TopLine’s Martin Hart to Present at Microelectronics Reliability and Qualification Workshop (MRQW)
01/16/2025 | TopLine CorporationTopLine Corporation’s Founder and CEO Martin Hart has been invited to deliver a presentation on the topic of how “Braided Solder Columns reduce mechanical stress in large heterogeneous 2.5D advanced packages for space and commercial applications” at The Aerospace Corporation’s Microelectronics Reliability and Qualification Workshop (MRQW) in Los Angeles (El Segundo), California on February 12, 2025.
TopLine to Sponsor IMAPS Wire Bonding Workshop in San Diego
01/09/2025 | TopLineTopLine Corporation will sponsor an Advanced Technical Workshop and Tabletop Exhibition on Wire Bonding February 3-4, 2025, in San Diego, California, hosted by The International Microelectronics Assembly and Packaging Society (IMAPS), it is announced today.
TopLine, TANAKA to Co-exhibit at IPC APEX 2024
03/06/2024 | TopLineTopLine Corporation will co-exhibit in booth #1231 with Tanaka Precious Metals at the upcoming IPC APEX 2024 conference and exhibition at the Anaheim Convention Center, Anaheim, California, April 9 – 11.