Flip Chips with Daisy Chain from TopLine Corporation are a cost-efficient way to learn electrical test for engineers seeking to understand and practice necessary techniques for working with Flip Chip components.
Available with full array bump or perimeter configurations, and in a range of body sizes and pitches, these dummy components are available with either Eutectic or SAC bumps, or with Copper Pillar with SnAg Solder Caps, in waffle packs or unsawn full wafers. They are currently in stock and available for immediate shipping.