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BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Introduction
October 16, 2024 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Introduction
One of the biggest challenges facing printed circuit board designers is properly understanding the cost drivers in the PCB manufacturing process, particularly the manufacturing of advanced technology PCBs.
Design for Manufacturing (DFM) is defined as the practice of designing printed circuit boards that meet not only the capabilities of the customer’s assembly manufacturing process, but also the capabilities of the board fabrication process to provide the highest reliability at the lowest possible cost.
The guidelines offered in this book are based on both ASC recommendations and IPC standards and apply to standard to advanced technology PCBs. UHDI technology may require violating many of the guidelines included within. It is also understood that some of these guidelines may require adjustment based on the material set, fabricator processes, and other design constraints.
While not a substitute for early design engagement with the PCB fabricator, in this book the reader will learn about these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability and help companies “design for success.”
Visit the I-Connect007 library to continue reading The Printed Circuit Designer’s Guide to DFM Essentials.
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.