-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueThe Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Optimizing mSAP to Produce Flex for Biofluid Sensor Probes
October 17, 2024 | Dean Neuburger, Sheldahl Flexible TechnologiesEstimated reading time: 1 minute
Improvements in flexible printed circuitry technology offer solutions that enable advancement in other technologies, enabling new circuit design and capability possibilities for customers’ applications. This article will overview advancements developed and implemented to produce a flexible circuit that meets new and challenging requirements for a customer’s medical application. This discussion will highlight development ideas more than details about the final processing scheme.
The medical application was a sensor designed to be inserted in a body to monitor activity of fluids by measuring minute electrical inflections. Good circuit performance required circuit production that achieves specific geometric precision of small circuit features with net ends far apart. Feature dimensions of the circuit design were approximately 75 µmdistance in one of the axes combined with overall length of approximately half a meter between net ends on opposite layers for circuit components and connector terminations.
An additional requirement was that the base material needed to be very thin to physically fit within the medical device. The material choice was Novaclad diclad, which is adhesiveless and available with 25 µm polyimide film, a very thin and flexible construction—appealing to the customer for functioning well in their application. The processing technique needed to be modified semi-additive processing (mSAP).
To read this entire article, which appeared in the October 2024 issue of Design007 Magazine, click here.
Suggested Items
The Test Connection, Inc. to Showcase Advanced Testing Solutions at SMTA Austin Expo & Tech Forum
02/04/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is excited to announce its participation in the SMTA Austin Expo & Tech Forum on February 6, 2025 in Austin, Texas.
DuPont Sets the Stage for Electronics Innovation at DesignCon 2025 Expo
01/29/2025 | DuPontDuPont, a leader in advanced material solutions and technologies, proudly announces its participation at DesignCon 2025 Expo, taking place January 29 - 30 in Santa Clara, California.
Würth Elektronik Launches Vibration-resistant Capacitors
01/29/2025 | Würth ElektronikAll SMT variants of the Aluminum Electrolyte and Aluminum Hybrid Polymer capacitors from Würth Elektronik are now available in an extremely vibration-resistant version on request.
Advanced Chip and Circuit Materials Shows 224 Gb/s Laminates and Prepregs at DesignCon 2025
01/27/2025 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) will be showing its high-performance circuit materials, including its Celeritas Series laminates and prepregs at the DesignCon 2025 exhibition.
Flexible PCB Market Size Projected to Reach $50.90 Billion by 2030
01/27/2025 | BUSINESS WIREThe global flexible printed circuit boards market size is projected to reach USD 50.90 billion by 2030, expanding at a CAGR of 13.7% from 2025 to 2030.