Connect the Dots: Designing for Reality—Pattern Plating
Elementary, Mr. Watson: The Gooey Centers of Hybrid PCB Designs
The Shaughnessy Report: Are You Partial to Partial HDI?
Optimizing mSAP to Produce Flex for Biofluid Sensor Probes
October 17, 2024 | Dean Neuburger, Sheldahl Flexible TechnologiesEstimated reading time: 1 minute
Improvements in flexible printed circuitry technology offer solutions that enable advancement in other technologies, enabling new circuit design and capability possibilities for customers’ applications. This article will overview advancements developed and implemented to produce a flexible circuit that meets new and challenging requirements for a customer’s medical application. This discussion will highlight development ideas more than details about the final processing scheme.
The medical application was a sensor designed to be inserted in a body to monitor activity of fluids by measuring minute electrical inflections. Good circuit performance required circuit production that achieves specific geometric precision of small circuit features with net ends far apart. Feature dimensions of the circuit design were approximately 75 µmdistance in one of the axes combined with overall length of approximately half a meter between net ends on opposite layers for circuit components and connector terminations.
An additional requirement was that the base material needed to be very thin to physically fit within the medical device. The material choice was Novaclad diclad, which is adhesiveless and available with 25 µm polyimide film, a very thin and flexible construction—appealing to the customer for functioning well in their application. The processing technique needed to be modified semi-additive processing (mSAP).
To read this entire article, which appeared in the October 2024 issue of Design007 Magazine, click here.
Share on:
Suggested Items
BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Introduction
10/16/2024 | I-Connect007 Editorial TeamDesign for Manufacturing (DFM) is defined as the practice of designing printed circuit boards that meet not only the capabilities of the customer’s assembly manufacturing process, but also the capabilities of the board fabrication process to provide the highest reliability at the lowest possible cost.
Site Consolidation at Würth Elektronik
10/09/2024 | Wurth ElektronikWürth Elektronik Circuit Board Technology, printed circuit board manufacturer headquartered in Niedernhall, Baden-Württemberg, announced at the company meeting the planned closure of its PCB production in Schopfheim.
Indian PCB Market Projected to Reach $20.17 Billion by 2032
10/05/2024 | openPRThe Indian printed circuit board (PCB) market has witnessed significant growth in recent years, reaching a value of US$4.53 billion in 2023. The market is expected to grow at an impressive compound annual growth rate (CAGR) of 18.1% between 2024 and 2032, eventually reaching a projected value of nearly $20.17 billion by 2032.
Designer's Notebook: Heterogeneous Integration and High-density SiP Technologies
10/03/2024 | Vern Solberg -- Column: Designer's NotebookOften, our primary goal is to maximize product functionality without increasing product size. Developing a multifunction silicon-based semiconductor (system-on-chip) for a specific product application, however, requires a significant investment in both engineering and financial resources. The problem is that many of the newer generations of semiconductor die have actually increased in size, with higher I/O and terminal pitch variations that have become significantly smaller.
Department of Defense Awards $30 Million to Expand Domestic Printed Circuit Board and Substrate Production
10/01/2024 | Department of DefenseThe Department of Defense announced today a $30 million award to TTM Technologies Inc. (TTM) in Santa Ana, California. This award, facilitated through the Defense Production Act Purchases (DPAP) office, will enable TTM to acquire and install advanced manufacturing equipment and develop prototype designs for printed circuit boards. The project will commence at TTM's Centers of Excellence across the United States, ultimately culminating in integration into its new Syracuse, New York facility. This strategic initiative aims to enhance TTM's capabilities and enable the timely delivery of cutting-edge technology to support vital defense programs.