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Build Better 2024 Summit: Creating a Vision for Future Tech
October 18, 2024 | Marcy LaRont, I-Connect007Estimated reading time: 4 minutes
Most likely, there aren’t many manufacturing summits that take place on an aircraft carrier, so it was pretty impressive to be on the USS Hornet, with a beautiful view of the San Francisco harbor at Build Better 2024 on Wednesday, October 16, 2024. The event was billed as “the only manufacturing summit for engineering and operations leaders developing electronics.”
I appreciated that the summit leveraged its location by focusing solely on manufacturing and NPI, but with a strong software and AI lens—we were in Silicon Valley, after all. This “boat” is now a museum in Alameda, and was the perfect place to congregate, learn, and network.
Certainly, when it was built, the USS Hornet was cutting-edge defense tech for its time, so it was not lost on me that a piece of American history is an interesting juxtaposition for a conference focused on creating visionary, future tech. The location served to highlight the industry’s current focus on defense and its nexus with technology in today’s complicated world.
The conference, aptly named “The Next Way,” featured 11 short presentations, several of which were only 15 minutes long, and three dedicated networking events throughout the day. This rapid-fire approach to presentations was a good way to keep the audience engaged, especially with breaks to network, which all the attendees seemed to capitalize on.
The event was hosted by Instrumental, a manufacturing software company offering an AI and data platform for manufacturers to connect existing data and generate new data, including an interesting new feature using AI to more quickly get through the failure analysis process. Anna-Katarina Shedetsky, co-founder and CEO of Instrumental, explained that this tool allows for companies to quickly react to minor product variations, literally going through thousands of variations and identifying the ones that really matter. She indicated that this would both decrease product development time and allow OEMs to build more profit margin into their products up front.
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From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.
The Next Generation of Leadership: New Student Board Member Aubrey Smith
04/10/2026 | Marcy LaRont, I-Connect007At APEX EXPO 2026, the next generation of industry leadership was on full display with the introduction of Aubrey Smith, the Global Electronics Association’s newest Student Board Member. She’s a third-year electrical and electronics engineering student at the University of Georgia and a first-year participant in the Emerging Engineer Program. Aubrey represents the curiosity, initiative, and openness that define tomorrow’s innovators.
ASC Sunstone Circuits Implements Smart Parts Technology at Mulino Facility to Enhance PCB Manufacturing Efficiency
04/09/2026 | ASC Sunstone CircuitsASC Sunstone Circuits, a division of American Standard Circuits, has implemented Smart PartsTM Classics technology at its Mulino, Oregon, manufacturing facility, advancing its commitment to efficient, high-quality PCB fabrication.
Dan’s Biz Bookshelf: ‘The 'NVIDIA Way: Jensen Huang and the Making of a Tech Giant’
04/09/2026 | Dan Beaulieu -- Column: Dan's Biz BookshelfI just finished "The NVIDIA Way" by Tae Kim, and let me tell you, this isn’t just a book about a semiconductor company. It’s a book about conviction, stubborn vision, and, most of all, what happens when a leader refuses to think small. At the center of it all is Jensen Huang. Kim does a masterful job showing us that NVIDIA’s rise wasn’t luck, timing, or some Silicon Valley fairy dust. It was discipline and obsession. It was long-term thinking in a world addicted to quarterly results.
Meet Emerging Engineer Logan Bistodeau, IBM
04/09/2026 | Michelle Te, I-Connect007When he was growing up, Logan Bistodeau was always interested in how heavy machinery worked, so it was natural that he earned a mechanical engineering degree at Iowa State University. He originally grew up near the Twin Cities in Minnesota, now works for IBM, and is in his first year of the Emerging Engineer Program through the Global Electronics Association. I got to know Logan a little better at APEX EXPO 2026.