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Henkel, Teca-Print Partner to Drive Novel Pad Printing Solutions in Printed Electronics

10/22/2024 | WEBWIRE
Henkel and Teca-Print today have announced a partnership in the pad printing field of printed electronics

Koh Young Technology Showcasing its Inspection Solutions at electronica and SEMICON Europa

10/22/2024 | Koh Young Technology
Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions at Messe München on November 12-15, 2024.

Feeble ROI in 5G Network Security Market Feeling Sting of Global Economic Slowdown

10/22/2024 | ABI Research
According to ABI Research, a global technology intelligence firm, the slowing of the 5G network rollout in 2023 has had a knock-on effect on the market demand for enterprise cybersecurity.

SAIC, Wind River Expand Strategic Partnership to Accelerate Development and Deployment of Mission-Critical Systems

10/22/2024 | SAIC
Science Applications International Corp. and Wind River® have announced an expanded strategic partnership to deliver industry-leading technologies to government customers by easing mission-oriented integration, speeding development and enhancing functionality in systems, for the U.S. Army and other government entities, including Cabinet-level departments and independent agencies.

KDDI Selects Samsung To Deploy Open RAN Powered by Virtualized RAN in Japan

10/21/2024 | Samsung
Samsung Electronics announced that the company has been selected by KDDI as a main vendor to provide 4G and 5G O-RAN compliant virtualized Radio Access Network (vRAN) solutions for their Open RAN deployment in Japan.
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