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SEMICON Japan 2024 to Expand Scope with Spotlight on Advanced Design Innovation

10/23/2024 | SEMI
SEMICON Japan 2024, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will assemble more than 1,000 exhibitors showcasing semiconductor solutions for smart technologies from Dec. 11-13 at Tokyo Big Sight.

Unlock Unmatched Performance for Matched Impedance Devices with StratEdge at IEEE BCICTS 2024

10/22/2024 | StratEdge
StratEdge Corporation, an industry leader in high-frequency and high-power semiconductor packaging, is excited to announce its participation in the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS).

Global Silicon Wafer Shipments to Remain Soft in 2024 Before Strong Expected Rebound in 2025

10/21/2024 | SEMI
Global shipments of silicon wafers are projected to decline 2% in 2024 to 12,174 million square inches (MSI) with a strong rebound of 10% delayed until 2025 to reach 13,328 MSI as wafer demand continues to recover from the downcycle, SEMI reported in its annual silicon shipment forecast.

SIA Applauds CHIPS Act Incentives for Wolfspeed Manufacturing in North Carolina and New York

10/16/2024 | SIA
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Wolfspeed.

SEMICON Europa 2024 to Explore Innovations in Advanced Packaging and Fab Management for a Sustainable Future

10/15/2024 | SEMI
Semiconductor industry experts will convene at SEMICON Europa 2024, November 12-15 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management.
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