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SEMICON Japan 2024 to Expand Scope with Spotlight on Advanced Design Innovation

10/23/2024 | SEMI
SEMICON Japan 2024, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will assemble more than 1,000 exhibitors showcasing semiconductor solutions for smart technologies from Dec. 11-13 at Tokyo Big Sight.

Calumet Electronics Leads US Organic Substrate Technology Innovation with KLA Corporation

10/17/2024 | Calumet Electronics
Calumet Electronics of Michigan today announced it is pioneering organic substrate technology in the United States in collaboration with KLA Corporation, which also has a Michigan headquarters. KLA Corporation is a global technology leader that develops equipment and services to enable innovation throughout the electronics industry. The company provides advanced process control and process-enabling solutions used in the manufacturing of semiconductors and electronics.

SEMICON Europa 2024 to Explore Innovations in Advanced Packaging and Fab Management for a Sustainable Future

10/15/2024 | SEMI
Semiconductor industry experts will convene at SEMICON Europa 2024, November 12-15 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management.

Amkor, TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona

10/08/2024 | TSMC
Amkor Technology, Inc. and TSMC announced that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem.

TAZMO, TAIFLEX Ink MoU on Taiwan-Japan Semiconductor Cooperation

10/04/2024 | TAIFLEX Scientific Co. Ltd
Tazmo Co., Ltd. and TAIFLEX Co., Ltd.  held a public signing ceremony and press conference for the “Memorandum of Understanding on Taiwan-Japan Semiconductor Cooperation” in Taipei.
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