-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Keysight Collaborates with Siemens EDA to Enable the Next Generation of Wireless Design
October 23, 2024 | Keysight TechnologiesEstimated reading time: 1 minute
Keysight Technologies, Inc. and Siemens EDA have teamed up to accelerate the efficiency of wireless and defense system design. The integration between Keysight’s Advanced Design System (ADS) and the Siemens Xpedition Enterprise suite of EDA tools enables engineers to more efficiently co-design digital systems and radio frequency (RF) circuits by performing layout and manufacturing in Xpedition and RF Circuit and electromagnetic simulation in Keysight ADS.
Today’s complex wireless and defense system designs demand unprecedented levels of integration between RF and overall system design. These advanced solutions often combine intricate RF components, high-speed digital circuits, and sophisticated signal processing, all of which must work harmoniously.
The collaboration builds on the prior dynamic inter-tool integration from Keysight and Siemens EDA that enabled system design to have bidirectional integration with RF and microwave engineering tools. This initiative integrates complete hierarchical designs bidirectionally between Keysight ADS and Siemens Xpedition Designer and Layout, eliminating the cumbersome and error-prone task of manually translating libraries between the tools.
Engineers can now seamlessly transition between detailed RF design in ADS and system-level design in Xpedition, maintaining integrity across the entire development process. This is crucial for optimizing performance in areas including 5G/6G communications, advanced radar systems, and electronic warfare applications, where the interplay between RF and digital domains is critical to system performance.
The new product is included in Keysight Advanced Design System 2025 and Siemens Xpedition Enterprise release 2409.
Nilesh Kamdar, EDA Design & Verification lead at Keysight said:“We have a long-established track record collaborating with Siemens to support customers in enabling the next generation of wireless design. The bidirectional integration allows engineers to optimize performance across various applications, including 5G/6G and radar systems.”
AJ Incorvaia, Senior Vice President, Electronic Board Systems, Siemens Digital Industries Software said: “As engineering teams strive to achieve digital transformation, the digital thread between RF and electronic system design becomes more critical. We’re pleased to announce improved integration enabling concurrent design to optimize system performance and improve quality while accelerating design closure.”
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Changing Times: Siemens Plans to Sell Former Mentor Graphics Wilsonville Campus
04/22/2026 | Nolan Johnson, I-Connect007Siemens announced it will be selling its Wilsonville, Oregon, property, which has served as the campus for Mentor Graphics, which was later acquired by German EDA-giant Siemens, as reported by The Oregonian on April 20. Siemens will maintain one building on the sprawling 53-acre campus, citing the move to hybrid and remote work over the past few years as a key factor in the decision.
Siemens Collaborates with TSMC to Advance AI for Semiconductor Design
04/22/2026 | SiemensSiemens announced the continuation of collaboration with TSMC to drive innovation in AI-powered automation and advanced semiconductor design enablement.
Standardization, Workforce, and the Road Ahead for Flex–Packaging Integration, Part 3
04/22/2026 | Anaya Vardya, American Standard CircuitsParts 1 and 2 of this series established the technical foundation and application landscape for the convergence of flexible PCBs and advanced semiconductor packaging. Part 3 addresses what comes next: the standards frameworks, talent pipelines, and strategic imperatives that will determine whether the industry can scale this convergence reliably and competitively.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
FlashPCB Names Matthew Belknap Production Manager as Operations Continue to Ramp
04/21/2026 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, has promoted Matthew Belknap to Production Manager, following his recent start with the company earlier this year.