-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueProper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Keysight Collaborates with Siemens EDA to Enable the Next Generation of Wireless Design
October 23, 2024 | Keysight TechnologiesEstimated reading time: 1 minute
Keysight Technologies, Inc. and Siemens EDA have teamed up to accelerate the efficiency of wireless and defense system design. The integration between Keysight’s Advanced Design System (ADS) and the Siemens Xpedition Enterprise suite of EDA tools enables engineers to more efficiently co-design digital systems and radio frequency (RF) circuits by performing layout and manufacturing in Xpedition and RF Circuit and electromagnetic simulation in Keysight ADS.
Today’s complex wireless and defense system designs demand unprecedented levels of integration between RF and overall system design. These advanced solutions often combine intricate RF components, high-speed digital circuits, and sophisticated signal processing, all of which must work harmoniously.
The collaboration builds on the prior dynamic inter-tool integration from Keysight and Siemens EDA that enabled system design to have bidirectional integration with RF and microwave engineering tools. This initiative integrates complete hierarchical designs bidirectionally between Keysight ADS and Siemens Xpedition Designer and Layout, eliminating the cumbersome and error-prone task of manually translating libraries between the tools.
Engineers can now seamlessly transition between detailed RF design in ADS and system-level design in Xpedition, maintaining integrity across the entire development process. This is crucial for optimizing performance in areas including 5G/6G communications, advanced radar systems, and electronic warfare applications, where the interplay between RF and digital domains is critical to system performance.
The new product is included in Keysight Advanced Design System 2025 and Siemens Xpedition Enterprise release 2409.
Nilesh Kamdar, EDA Design & Verification lead at Keysight said:“We have a long-established track record collaborating with Siemens to support customers in enabling the next generation of wireless design. The bidirectional integration allows engineers to optimize performance across various applications, including 5G/6G and radar systems.”
AJ Incorvaia, Senior Vice President, Electronic Board Systems, Siemens Digital Industries Software said: “As engineering teams strive to achieve digital transformation, the digital thread between RF and electronic system design becomes more critical. We’re pleased to announce improved integration enabling concurrent design to optimize system performance and improve quality while accelerating design closure.”
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
I-Connect007 Editor's Choice: Five Must-Reads for the Week
08/22/2025 | Andy Shaughnessy, I-Connect007In this week’s roundup, we have a variety of articles covering design, manufacturing, sustainability, and, of course, tariff negotiations. We have a milestone anniversary to celebrate as well, with Dan Beaulieu about to publish his 1,000th column. When does Dan even sleep? Here’s to hoping that we have 1,000 more weeks of "It’s Only Common Sense."
New Episode Drop: MKS’ ESI’s Role in Optimize the Interconnect
08/21/2025 | I-Connect007In this latest episode, Casey Kruger, director of product marketing at MKS’ ESI, joins On the Line With… host Nolan Johnson to share how CO₂ laser technology delivers faster, more accurate vias in a smaller, more energy-efficient footprint.
PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
How Good Design Enables Sustainable PCBs
08/21/2025 | Gerry Partida, Summit InterconnectSustainability has become a key focus for PCB companies seeking to reduce waste, conserve energy, and optimize resources. While many discussions on sustainability center around materials or energy-efficient processes, PCB design is an often overlooked factor that lies at the heart of manufacturing. Good design practices, especially those based on established IPC standards, play a central role in enabling sustainable PCB production. By ensuring designs are manufacturable and reliable, engineers can significantly reduce the environmental impact of their products.
Meet the Round 1 Winners of the Bright Manufacturing Student Challenge 2025
08/20/2025 | Tara Dunn, SMTAThe Bright Manufacturing Student Challenge is an opportunity for student teams to design and develop innovative solutions for real-world electronics manufacturing problems. The eight-week competition, sponsored by the Electronics Manufacturing & Assembly Collaborative (EMAC) through electronicsworkforce.com, allows students to showcase their technical skills, creativity, and problem-solving abilities.