Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

DELO Introduces UV-approach for Fan-out Wafer-level Packaging

10/25/2024 | DELO
DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimizes the energy consumption.

Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1

10/25/2024 | I-Connect007
The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.

Global PCB Connections: Mission Critical—Communication Between PCB Designers and Fabricators

10/24/2024 | Jerome Larez -- Column: Global PCB Connections
In my first column, I want to discuss the critical importance of communications between the PCB design and the PCB fabrication engineer. I’ll explore why clear communication is so important, highlight the differences between standard and CTQ items, and outline the key issues that must be agreed upon to achieve success in PCB manufacturing.

Optimizing mSAP to Produce Flex for Biofluid Sensor Probes

10/17/2024 | Dean Neuburger,  Sheldahl Flexible Technologies
Improvements in flexible printed circuitry technology offer solutions that enable advancement in other technologies, enabling new circuit design and capability possibilities for customers’ applications. This article will overview advancements developed and implemented to produce a flexible circuit that meets new and challenging requirements for a customer’s medical application. This discussion will highlight development ideas more than details about the final processing scheme.

Untapped Potential: Automating Warehouse Management Into the Present

10/15/2024 | Josh Casper, Horizon Sales
The push toward automation in electronics manufacturing has led to significant improvements in SMT and through-hole technology (THT) production. Today’s manufacturers are outfitted with precision pick-and-place machines, sophisticated inspection systems, and advanced solder deposition solutions. These investments reflect a broader industry trend toward automating high-value production tasks to boost efficiency, improve quality, and reduce headcount in a shrinking labor market. While the spotlight has rightly focused on automating SMT production, one crucial area remains woefully under-invested: materials storage and handling.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in