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DELO Introduces UV-approach for Fan-out Wafer-level Packaging

10/25/2024 | DELO
DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimizes the energy consumption.

Gartner Forecasts Worldwide IT Spending to Grow 9.3% in 2025

10/24/2024 | BUSINESS WIRE
Worldwide IT spending is expected to total $5.74 trillion in 2025, an increase of 9.3% from 2024, according to the latest forecast by Gartner, Inc.

Cicor Recognized as a "Hidden Champion" in Swiss Media Reputation Study

10/23/2024 | Cicor
The Cicor Group has been honored with the first-place award in the "Hidden Champions" category of a recent Swiss media reputation study.

Henkel, Teca-Print Partner to Drive Novel Pad Printing Solutions in Printed Electronics

10/22/2024 | WEBWIRE
Henkel and Teca-Print today have announced a partnership in the pad printing field of printed electronics

SAIC, Wind River Expand Strategic Partnership to Accelerate Development and Deployment of Mission-Critical Systems

10/22/2024 | SAIC
Science Applications International Corp. and Wind River® have announced an expanded strategic partnership to deliver industry-leading technologies to government customers by easing mission-oriented integration, speeding development and enhancing functionality in systems, for the U.S. Army and other government entities, including Cabinet-level departments and independent agencies.
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