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Rehm Open House Celebrates 10 Years In Mexico

06/30/2025 | Nolan Johnson, I-Connect007
This week, Rehm Thermal Systems marks its 10th year in Guadalajara, Mexico, with a celebration that includes a demonstration area in its new building, and a recognition of the technology. Despite some challenges with economic situations between the U.S. and China, Rehm is moving forward and finding success.

Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop

06/26/2025 | Indium
Indium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A

Specially Developed for Laser Plastic Welding from LPKF

06/25/2025 | LPKF
LPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.

Reflections and Priorities: An Update to I-Connect007 Readers

06/24/2025 | Marcy LaRont, I-Connect007
The electronics and manufacturing industry is evolving rapidly—with new technologies, deeper global connections, and a growing drive toward sustainability. To reflect these changes and our place in this dynamic space, we’re refreshing our brand.

OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding

06/21/2025 | BUSINESS WIRE
OKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.
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