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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

11/01/2024 | Andy Shaughnessy, Design007 Magazine
It’s been a busy week in PCB design, fabrication, and assembly. We published some mixed news about the EMS segment, and an article about the supply chain. Are companies holding onto too much inventory? After the recent supply chain snafus, I can certainly understand why they might. We have an article about liquid metal ink, a cool new technology developed by LDQX, formerly known as Averatek. We also have an article about fighting advanced counterfeiting methods, and news about an acquisition by Siemens.

TPCA Show 2024 Highlights Taiwan-Thailand Industry-University Collaboration

10/22/2024 | TPCA
With growing investments in Thailand's PCB industry, the 2024 TPCA Show will feature a dynamic "Thailand Theme Zone" to promote collaboration between Taiwanese companies and Thai students.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/18/2024 | Nolan Johnson, SMT007 Magazine
Occasionally, I’ll intentionally select items for this list that follow a theme. Sometimes, as they did this week, themes assert themselves. The component supply chain and sourcing seem to dominate our coverage this week. We’ve got an update from IPC Government Relations, an interview with counterfeiting watchdog ERAI, the 10 global sourcing rules, a course on AI and machine learning in the EMS sector, and warehouse management.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/11/2024 | Andy Shaughnessy, Design007 Magazine
This week’s roundup is a duke’s mixture of news items and interviews with industry experts from design, fabrication and assembly. There’s a lot going on in electronics now. We’ll be bringing you full coverage of SMTA International the week of Oct. 20-24, so stay tuned.

Introducing the Ultra HDI Learning Pavilion at SMTA International 2024

10/07/2024 | SMTA
The SMTA is thrilled to announce the launch of the Ultra HDI (UHDI) Learning Pavilion, a first-of-its-kind experience dedicated to advancing Ultra-High Density Interconnect technology.
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