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Marcy’s Musings: Destination Metallization

10/17/2024 | Marcy LaRont -- Column: Marcy's Musings
To reach your intended destination, you must have some form of pathway or route upon which to travel. It is much the same with the metallized traces and features on a printed circuit board. They are how electrical signals and power are carried from one point to another in an electronic device. Copper is the most prevalent metal conductor, but other metals are also used to a lesser degree, including gold, silver, tin, and palladium.

PCB007 Magazine October 2024: Alternate Metallization Processes

10/16/2024 | I-Connect007 Editorial Team
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop taking us into new directions. In this issue of PCB007 Magazine, we examine the impact of alternate metallization methods giving a glimpse into how and when we will arrive at 'destination metallization'.

Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 5

08/06/2024 | Michael Carano -- Column: Trouble in Your Tank
Direct metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance throughout the world. Indeed, the environmental and productivity gains one can achieve with this process are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space? This is detailed below.

Real Time with… THECA 2024: MacDermid Alpha Electronics Solutions–A Critical Comparison of Metallization Methods

08/01/2024 | Real Time with... THECA
Carmichael Gugliotti, product manager for primary metallization, MacDermid Alpha Electronics Solutions, describes his research—presented here at THECA—looking at reliability, process efficiency, and environmental sustainability. Learn about his findings in this interview.

Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5

03/19/2024 | Michael Carano -- Column: Trouble in Your Tank
Direct metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?
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