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Murata’s Revolutionary Stretchable Printed Circuit Elevates Wearable Medical Devices Printed Circuit Products
October 31, 2024 | MurataEstimated reading time: 2 minutes
Murata Manufacturing Co., Ltd reveals an innovative new Stretchable Printed Circuit (SPC) technology marking a significant development in printed circuit technology. Murata's SPC represents the next advancement in substrate development, providing both flexibility and the capability to stretch and deform while maintaining full functionality. It is perfect for creating advanced medical products, like wearable therapeutic devices and vital monitoring tools, that can provide better accuracy, durability, and patient comfort than today’s equivalent devices.
In recent years, in the medical field, to make more accurate diagnoses, the importance of sophisticated tests performed in hospitals and biometric information collected continuously in daily life has increased. Daily vital sign monitoring is important to prevent lifestyle-related diseases, therefore wearable medical devices are now ubiquitous. However, existing devices are often too stiff for many applications, creating issues like patient discomfort, poor surface contact, or unstable data acquisition. Murata's SPC excels in its inherent flexibility, stretchability, and ability to adapt, supporting multi-sensing functionalities to address diverse user requirements. The material is incredibly soft and gentle on the skin, making it ideal for medical and wellness devices like EEG (Electroencephalogram), EMG (Electromyogram), and ECG(Electrocardiogram). Its stretchable nature can enable a single device to accommodate various body areas and patients of different sizes, as well as allowing more easily for continuous monitoring applications or monitoring in previously challenging areas such as elbows or knee joints.
Engineered with cutting-edge capabilities, including printing stretchable electrodes compliant with ANSI/AAMI EC12 standards, SPC paves the way for next-generation medical devices. It achieves seamless integration and optimal performance through innovative telescopic component mounting and hybrid bonding technology between substrates. By effectively blocking electromagnetic noise, the unique shield layer offers reliable protection for the signal path. Additionally, the substrate construction demonstrates excellent reliability, with high resistance to moisture and the ability to withstand high voltages for long durations, while allowing for more flexibility in component mounting, giving designers more freedom to innovate.
Murata's SPC can be tailored to meet individual customer specifications with the help of Murata’s extensive range of resources to facilitate collaborative product development. This can be harnessed by product designers, enabling them to optimize their designs. Murata can further support development by conducting tests in various conditions and resolving failure modes by identifying their root causes. Depending on the required specifications, filters, amplifiers, and multiple sensors can be mounted on a single sheet, enabling accurate data acquisition and sensing of several items. With this solution, Murata performs custom design, prototyping and verification, and mass production based on the required specifications.
Suggested Items
Are Our Stackup Rules No Longer Valid?
12/19/2024 | Cherie Litson, EPTAC MIT CID/CID+Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else. If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources.
Statistically Testing Inner Layer Yield Improvement Projects
12/18/2024 | Dr. Patrick Valentine, UyemuraCan we trust our measurement system to give us reliable data? Is it accurate, repeatable, and reproducible? Measurement is the foundation of quality. We measure for two primary reasons: to make decisions on product quality and to provide data that will inform continuous improvement projects. We can engage in continuous improvement projects if we are confident in our measurement systems.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
IPC Releases Latest List of Standards and Revisions
12/17/2024 | IPC Community Editorial TeamEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.