-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Survey Says Reshoring is a TCO Equation
August 13, 2025 | Nolan Johnson, SMT007 MagazineEstimated reading time: 2 minutes
Harry Moser, founder of the Reshoring Initiative, and Kathy Nunnally of Regions Recruiting partnered to survey contract manufacturers and OEMs earlier this year, querying them about their offshoring beliefs and practices. They found that while offshoring, tariffs, trade balances, and the like, are important to a company’s bottom line, there’s a larger and more extensive issue: workforce. In this interview, they detail the results of that survey and what they believe can and should be done to fix this long-standing issue.
Nolan Johnson: Harry and Kathy, let's start with some background on the Reshoring Initiative.
Harry Moser: I founded the Reshoring Initiative in 2010 as a nonprofit with a mission to balance the goods trade deficit, which was $1.2 trillion last year. We do that by documenting the trend so people can see it's real and happening, and by promoting the trend. We believe that by having tools such as our Total Cost of Ownership (TCO) Estimator available to help companies make smarter decisions, they can buy smarter and, in some cases, such as with contract manufacturers, sell smarter. That may convince the OEMs to buy from them.
Johnson: Harry, how did you come to be working in this space?
Moser: I was president of a $100-million-a-year company, and when I turned 65, the Swiss parent company told me it was time to leave. Since I was available and knew someone had to do something to reverse offshoring, I volunteered myself. Fortunately, I had excellent support from various manufacturing trade associations over the years, helping to make this possible.
Johnson: Kathy, what brought you to this project?
Kathy Nunnally: Regions Recruiting is supporting the manufacturing and B2B distribution industries with talent. We're helping advance those businesses with top talent, and it's an exciting time to be in the industry.
To continue reading this interview, which originally appeared in the August 2025 issue of SMT007 Magazine, click here.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
When Quality Is Personal: The Human Stakes Behind Electronics Reliability
05/06/2026 | Kelly DackIn electronics manufacturing, quality is often discussed in terms of specifications, standards, and process controls, but as industry veteran Doug Pauls reminds us, the stakes are far more human. In this conversation, Doug, a recipient of the Global Electronics Association’s Hall of Fame Award, draws on more than four decades of experience to illuminate the real-world consequences of reliability, where even a single defect can carry profound implications. He brings into sharp focus why quality isn’t just a metric, but a responsibility shared by everyone on the manufacturing floor.
PCBAA, AAM Take on the Fight to Rebuild U.S. Manufacturing in New Documentary
05/05/2026 | Marcy LaRont, I-Connect007Throughout most of the 20th century, manufacturing was central to the American Dream of providing stable jobs and pathways to upward mobility. Today, more than 80% of global electronics manufacturing capacity resides in China and greater Asia, raising serious concerns about supply chain resilience and national security.
Vern Solberg: A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.