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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/23/2026 | Marcy LaRont, I-Connect007
In my top five must-read items from this week’s articles and news, I am focusing on the interconnect because, honestly, who isn’t? We are in the interconnect business, and it just gets more complex and more fun every day. My interview with MKS Inc.’s Dr. John Lee and the accompanying article, which breaks down the technology, implications of current market realities, and their effect on the state of “the interconnect,” is my first choice this week.

Marcy’s Musings: A Frighteningly Good October Issue

10/19/2026 | Marcy LaRont -- Column: Marcy's Musings
This month, we spotlight MKS, which is expanding its role as an essential supplier to the PCB, assembly, and semiconductor supply chains. In addition to my interview with President and CEO John T.C. Lee, we examine the company’s efforts to develop technologies that bring high-end solutions to real-world manufacturing challenges. Together, they offer a powerful look inside an important industry company. I also want to share some thoughts on my summer travels. I came home from both trips energized and impressed by their enthusiasm, vision, and optimism, and what they have accomplished in a short time.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/16/2026 | Michelle Te, I-Connect007
Working from home really has its perks, especially when it comes to driving. I don’t miss the commute time, driving in the rain, or having to maneuver around everyone else going to work or coming home. Simply popping up to my desk in the morning is such a benefit. But what I do miss is being physically with my coworkers and the interactions that can happen when you’re all together. You just don’t get the synergy over a Teams call that you can get in person. Even more, being together fosters a sense of camaraderie you can’t get any other way.

From Substrates to Systems: A Preview of the October Advanced Electronics Packaging Digest

10/14/2026 | I-Connect007
The October issue of Advanced Electronics Packaging Digest examines the technologies, investments, and strategic decisions shaping the future of advanced electronics manufacturing. From the evolution of semiconductor scaling and the integration challenges of high-frequency systems to the expansion of semiconductor capabilities in the United States and India, this issue explores how materials, packaging architectures, and manufacturing infrastructure are becoming interconnected.

KYZEN's Chelsea Jewell to Present on Pre-Immersion Cleaning Chemistries at OCP Global Summit 2026

10/09/2026 | KYZEN
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce that Chelsea Jewell, KYZEN Application Lab Manager, will present as part of the Open Compute Project (OCP) Global Summit scheduled to take place from October 12-15, 2026, at the San Jose Convention Center in San Jose, California.
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