Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

JAVAD EMS to Add New ESPEC Temperature Chamber to Support Growing Mil/Aero Work

04/28/2026 | JAVAD EMS
JAVAD EMS (JEMS), a leading global EMS company that provides low to medium volume, high-mix applications, has ordered a new ESPEC EGNZ28-15NW temperature cycling chamber to expand its environmental testing capabilities as demand continues to grow in the military and aerospace sectors.

TRI Launches New Wafer Inspection and Metrology Platform

04/28/2026 | TRI
Test Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, is proud to announce the launch of the TR7950Q SII Series.

Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026

04/21/2026 | Koh Young America
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, is bringing its battle-tested platform to where that challenge is being solved at the 2026 IEEE Electronic Components and Technology Conference (ECTC), May 26–29, at the JW Marriott & The Ritz-Carlton Grande Lakes in Orlando, Florida. The advanced packaging industry is demanding a level of inspection precision that traditional metrology simply cannot deliver, and Koh Young is ready to meet that moment.

Controlar Introduces PicAI to Strengthen Probe Inspection in Electronics Manufacturing

04/16/2026 | Controlar
Controlar is bringing a new level of precision and control to electronics testing with the launch of PicAI (AI-Driven Probe Inspection Control), a fully automated system designed to replace manual ICT fixture verification in high-reliability environments.

BEST Inc. Publishes Optimizing BGA Rework Techniques to Ensure Quality Tech Paper

04/15/2026 | BEST Inc.
BEST Inc., a leader in electronic component and PCB services, is pleased to announce they have published a tech paper describing techniques for reworking BGA components to ensure quality during the printed circuit board rework process.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in