Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
PAC-3 Engages Advanced Target in Flight Test Supporting U.S. Army Modernization Strategy
November 5, 2024 | Lockheed MartinEstimated reading time: 1 minute
Lockheed Martin’s Patriot Advanced Capability – 3 (PAC-3) missile successfully integrated with Raytheon’s Lower Tier Air and Missile Defense Sensor (LTAMDS) radar to defeat an advanced Tactical Ballistic Missile (TBM). The test validated advanced software updates that ensures PAC-3 can defeat evolving threats within the U.S. Army’s modernized Integrated Air and Missile Defense (IAMD) architecture.
During the flight test at White Sands Missile Range, PAC-3 Missile Segment Enhancement (MSE) and Cost Reduction Interceptor (CRI) confirmed the ability to detect, acquire, track and engage an advanced TBM target. The interceptors were shot in a ripple configuration and successfully engaged and intercepted the TBM target.
“Integrating PAC-3 with new, advanced systems to deliver next-generation deterrence capability is a critical piece of the U.S. Army’s modernization strategy,” said Brian Kubik, vice president of PAC-3 Programs. “This is 21st Century Security® in action – by harnessing digital technologies to network platforms together, Lockheed Martin is increasing the effectiveness and deterrent value of defense solutions for our customers, ensuring they have the technology needed to stay ahead in an evolving threat environment.
To prepare for today’s flight test, Lockheed Martin partnered with the U.S. Army to conduct a series of ground testing and captive carry tests. This builds upon previously demonstrated PAC-3 capability with the U.S. Army’s Integrated Battle Command System (IBCS) and LTAMDS radar.
PAC-3 uses Hit-to-Kill technology to defend against threats through direct body-to-body contact that delivers exponentially more kinetic energy on the target than can be achieved with blast-fragmentation mechanisms. PAC-3 is effective against current and evolving threats including aircraft, tactical ballistic missiles, advanced threats including hypersonics, and cruise missiles.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
High Density Packaging User Group Announces European Space Agency Membership
11/04/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that the European Space Agency (ESA) has become a member.
Nortech Systems Incorporated Earns AS9100 Certification for Monterrey, Mexico Facility
11/04/2025 | BUSINESS WIRENortech Systems, Incorporated, a leading provider of design and manufacturing solutions for complex electromedical devices and electromechanical systems, announced that its Monterrey, Mexico, facility has achieved AS9100:D certification.
PsiQuantum, Lockheed Martin Form Strategic Collaboration to Accelerate Quantum Computing for Aerospace and Defense
11/04/2025 | BUSINESS WIREPsiQuantum and Lockheed Martin have signed a memorandum of understanding (MoU) to accelerate the development of quantum computing applications in aerospace and defense.
Northrop Grumman Collaborates on AI-Designed Spacecraft Propulsion Element
11/03/2025 | Northrop GrummanNorthrop Grumman Corporation and Luminary Cloud are applying artificial intelligence (AI) to spacecraft propulsion with a new physics AI foundation model capable of rapidly designing a spacecraft thruster nozzle.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.