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Real Time with... electronica 2024: NCAB—Shaping the Future of Electronics Manufacturing

12/05/2024 | Real Time with... electronica
Michael Larsson, Global Director of Sales at NCAB, shares insights into the company's focus on sourcing production outside of China as well as their commitment to sustainability through innovative materials for recyclable PCBs.

UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 1

11/14/2024 | Anaya Vardya, American Standard Circuits
Last month, I talked about ultra high definition interconnect (UHDI) in relation to entertainment applications. This month, I will explain bleeding-edge UHDI applications in manufacturing, which are revolutionizing the industry by enabling ultra-precise visual data transmission, high-speed communication between devices, and real-time monitoring. These UHDI technologies help manufacturers achieve higher efficiency, better quality control, and greater automation. Following are some leading-edge manufacturing applications of UHDI in manufacturing.

Partial HDI: A Delicate Balance

10/30/2024 | I-Connect007 Editorial Team
Partial HDI can be the perfect solution for designers faced with escape routing from tight-pitch BGAs. But there are a variety of material, signal integrity, and DFM trade-offs to understand before you get fully into partial HDI. We asked Stephen Chavez to explain the fundamentals, as well as the details, of this promising process. Are you using partial HDI?

Flexible Thinking: Musings on High Density Interconnections

10/30/2024 | Joe Fjelstad -- Column: Flexible Thinking
People have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.

Real Time with... SMTAI 2024: Summit Interconnect Doing Its Part to Rebuild Industry Expertise

10/29/2024 | Real Time with...SMTAI
In this interview from the recent SMTAI show, Nolan Johnson speaks with Jesse Vaughan from Summit Interconnect.  Jesse hits the highlights for some of Summit's programs to promote skilled workers in our industry—programs such as apprenticeships, Emerging Engineers, and more.
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