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American Standard Circuits to Exhibit at IMS 2025
June 12, 2025 | American Standard CircuitsEstimated reading time: 1 minute
Anaya Vardya, President and CEO of American Standard Circuits & ASC Sunstone Circuits, announced that his companies will exhibit at the IEEE International Microwave Symposium (IMS 2025), taking place June 15-20, 2025, at San Francisco’s Moscone Center.
“IMS is the microwave industry’s premier gathering. It gives us the perfect platform to sit down face-to-face with designers, engineers, and sourcing professionals,” Mr. Vardya said. “Our experts will be on hand to discuss the latest breakthroughs in Ultra-HDI miniaturization, Laminated Liquid-Crystal-Polymer (LCP) RF modules, and advanced flex and rigid-flex interconnect solutions—technologies that are redefining size, weight, and performance for high-frequency systems.
Visitors to the American standard booth (#2336) can:
- Review live samples featuring 10 µm lines/spaces and stacked microvias for next-gen Ultra-HDI layouts
- Explore licensed multilayer LCP constructions that deliver exceptionally low loss up to millimeter-wave frequencies
- Discuss flex and long-format rigid-flex builds—including boards up to 30 inches—with IPC-verified reliability
- Schedule in-depth design reviews or factory tours with ASC’s RF/microwave and UHDI engineering teams
Show attendees can meet the ASC team on the show floor in Booth 2336.
Check out these educational offerings from American Standard Circuits | ASC Sunstone:
- The Printed Circuit Designer's Guide to... DFM Essentials
- The Printed Circuit Designer’s Guide to... Fundamentals of RF/Microwave PCBs
- The Printed Circuit Designer’s Guide to... Flex and Rigid-Flex Fundamentals
- The Companion Guide to Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator's Perspective
- On the Line with...ASC Sunstone: Design for Manufacturing Podcast
Visit I-007eBooks.com to download these and other free titles.
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Brent Fischthal - Koh YoungSuggested Items
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Flexible Printed Circuit Board Market to Reach US$40.447 Billion by 2030
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Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials
07/02/2025 | Barb Hockaday, I-Connect007In a dynamic and informative Innovation Symposium hosted live and on Zoom on June 25, 2025, representatives from Qnity (DuPont's electronics business), DuPont, and Insulectro discussed the evolving landscape of flexible circuit materials. From strategic corporate changes to cutting-edge polymer films, the session offered deep insight into design challenges, reliability, and next-gen solutions shaping the electronics industry.