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INEMI Launches Study of AOI Inspection for Fine Pitch Substrates Seeking Industry Participation

03/11/2025 | iNEMI
The fine lines and spaces of increasingly popular heterogeneous SiP packages, coupled with larger panel sizes and more substrate layers, demand increased capabilities from automated optical inspection (AOI) equipment to accurately detect, characterize and reject true defects without over-rejections.

Koh Young Showcases Inspection Innovations at IPC APEX EXPO 2025 in Anaheim, California during March 18-20, 2025

03/10/2025 | Koh Young
Koh Young, the global leader in True3D measurement-based inspection solutions and the exclusive Premier Sponsor of IPC APEX EXPO 2025, invites electronics manufacturers to Booth 2130 for an in-depth look at its cutting-edge inspection technologies. Taking place at the Anaheim Convention Center from March 18–20, 2025, this year’s event highlights Koh Young’s continued advancements in AI-powered process optimization and quality assurance.

TASMIT Launches Large Glass Substrate Inspection System for Advanced Semiconductor Packaging

03/04/2025 | ACCESSWIRE
TASMIT Inc. has launched a new inspection system for glass substrates as part of its INSPECTRA® series of semiconductor wafer visual inspection systems, which has gained attention for its high efficiency in advanced semiconductor manufacturing.

Incap’s Estonian Factory Invests in Innovative X-ray Technology

03/04/2025 | Incap
The electronics manufacturing company Incap Estonia, based in Saaremaa, has enhanced its quality control capabilities with a new high-resolution X-ray system.

Koh Young America Expands Sales Network with Electronic Assembly Products for Colorado and Utah

03/04/2025 | Koh Young America
Koh Young America, the global leader in True 3D measurement-based inspection and metrology solutions, is pleased to announce the addition of Electronic Assembly Products, Inc. (EAP) as its sales representative for Colorado and Utah, effective March 3, 2025.
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