Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
The Shaughnessy Report: Breaking Down the Language Barrier
Connect the Dots: Designing for Reality—Routing, Final Fab, and QC
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
November 12, 2024 | SMTAEstimated reading time: 1 minute
The SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.
Our speaker, Bob Bouchard of BTU International, will be giving his presentation, Solder Reflow Oven Fundamentals and Thermal Profiling Approaches. This presentation will provide a comprehensive overview of reflow oven technology, covering essential topics such as heating methods, atmosphere control, hardware configurations, and forced convection, all in relation to meeting specific reflow process requirements. We will also explore the critical role of thermal profiles, how to align them with solder paste manufacturers' specifications, general profiling approaches, and process monitoring tools. Attendees will gain practical insights into key aspects of the PCB manufacturing process for reflow soldering, equipping them with the knowledge needed to optimize and enhance their processes.
This session benefits SMT engineers, process managers, and production supervisors working in PCB manufacturing. Attendees will better understand reflow soldering processes, allowing them to optimize oven settings, enhance production consistency, and reduce defects. By mastering these concepts, participants will be better equipped to troubleshoot issues, improve yield, and maintain high standards in soldering quality.
Register at SMTA website.
About Presenter, Bob Bouchard:
Bob is the Director of Sales and Marketing - Americas for BTU International. He has been with BTU in various technical, marketing and sales roles at BTU for over 30 years. While spending much his career in product development and product management, Bob Has been in the industry since the mid 1990’s involved with many thermal applications and processes including SMT reflow, curing, semiconductor packaging, solar cells and other high temperature applications such as brazing, sintering and hybrid electronics.
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