Global PCB Connections: Following DFM Rules Leads to Better Boards
Elementary Mr. Watson: How to Reinvent Your Professional Journey
Fresh PCB Concepts: PCB Plating Process Overview
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
November 12, 2024 | SMTAEstimated reading time: 1 minute
The SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.
Our speaker, Bob Bouchard of BTU International, will be giving his presentation, Solder Reflow Oven Fundamentals and Thermal Profiling Approaches. This presentation will provide a comprehensive overview of reflow oven technology, covering essential topics such as heating methods, atmosphere control, hardware configurations, and forced convection, all in relation to meeting specific reflow process requirements. We will also explore the critical role of thermal profiles, how to align them with solder paste manufacturers' specifications, general profiling approaches, and process monitoring tools. Attendees will gain practical insights into key aspects of the PCB manufacturing process for reflow soldering, equipping them with the knowledge needed to optimize and enhance their processes.
This session benefits SMT engineers, process managers, and production supervisors working in PCB manufacturing. Attendees will better understand reflow soldering processes, allowing them to optimize oven settings, enhance production consistency, and reduce defects. By mastering these concepts, participants will be better equipped to troubleshoot issues, improve yield, and maintain high standards in soldering quality.
Register at SMTA website.
About Presenter, Bob Bouchard:
Bob is the Director of Sales and Marketing - Americas for BTU International. He has been with BTU in various technical, marketing and sales roles at BTU for over 30 years. While spending much his career in product development and product management, Bob Has been in the industry since the mid 1990’s involved with many thermal applications and processes including SMT reflow, curing, semiconductor packaging, solar cells and other high temperature applications such as brazing, sintering and hybrid electronics.
Share on:
Suggested Items
SMT007 Magazine Explores Soldering Technologies—December 2024
12/02/2024 | I-Connect007 Editorial TeamSoldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
Bransys Acquires Two REHM VisionXP+ Nitro 3850 Reflow Ovens
10/14/2024 | BransysBransys Group, a leading provider of comprehensive PCB design and assembly services, is pleased to announce the addition of two REHM VisionXP+ Nitro 3850 Type 834 reflow ovens to its state-of-the-art manufacturing facility.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4
10/03/2024 |Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 3
08/14/2024 | I-Connect007 Editorial TeamChapter 3 of this book delves into the critical aspects of the SMT process, focusing on the reflow oven and automated optical inspection (AOI) machine. Highlighted are the key roles of the line operator, manufacturing engineer, and quality manager in maintaining efficient operations and high-quality PCBAs.
Solderstar to Present Advanced Reflow Profiling Solution at SMTA International 2024
08/08/2024 | SolderStarSolderstar, a leader in innovative profiling solutions for the electronics manufacturing industry, is exhibiting at the SMTA International 2024 conference in Rosemont, Illinois, booth 2838, from October 22-24.